Recently, the good news came from Shanghai Microelectronics that the first 2.5D/3D advanced encapsulated lithography machine manufactured by the company was officially delivered to customers. This is the first 2.5D/3D advanced encapsulated lithography machine delivered in China, and its significance is self-evident.
It is reported that the lithography machine delivered this time is mainly used in high-density heterogeneous integration fields such as high-end AI chips, which can meet the advanced packaging application requirements of 2.5D/3D super chip size.
However, it should be clarified that the encapsulated lithography machine is different from the lithography machine produced by Asma, and there is still a huge gap with Asma.
First of all, chip production is divided into three links: chip design, manufacturing, and packaging and testing. Chip manufacturing enables predetermined chip functions, including lithography machines, etching machines, ion implantation, chemical mechanical grinding and other steps.
The encapsulated lithography machine is the final process before the product is delivered for chip packaging and performance and functional testing. It is equivalent to the lithography machine manufacturing the function, and the encapsulated lithography machine is plus the switch. The encapsulated lithography machine belongs to the later process, and the technical content and price of asma lithography machine are much higher than that of the encapsulated lithography machine.
The EUV lithography machine manufactured by Asmail is currently the most advanced model. The machine weighs 180 tons and has more than 100,000 parts. These parts come from all over the world, and Western countries are the main suppliers.
When Western countries first manufactured high-end lithography machines, a total of about 110 units were assembled. After years of hard research and development, the EUV lithography machine was finally manufactured. To some extent, it is more difficult to manufacture than the atomic bomb. If China wants to build a high-end lithography machine on its own, you can imagine how difficult it is.
There is a Chinese saying that "a bite can not be a fat man, one step can not reach the edge of the sky" . Whatever you do, take it slowly. Although the Shanghai microelectronics manufacturing is not the former road lithography machine, for China, the encapsulated lithography machine is also very important. The fact that Shanghai Microelectronics can manufacture it shows that technological progress has been made is worthy of praise.
As long as you keep improving, that's a good sign. Even if you go slowly, it doesn't matter, the most important thing is to achieve results and overcome technology. If you always stand still, this should arouse people's vigilance.
In the absence of advanced lithography machines, some companies are developing alternative technologies. Huawei, for example, has developed chip overlay technology. The connected chips that have undergone special process treatment are combined into a chipset. That is, the use of two 14nm chips to achieve the performance of a single 7nm chip. The package lithography machine has the ability to realize multi-chip high-density interconnect packaging. #中国首台新一代先进封装光刻机交付 #
