Jiwei network news, recently, Jiwei network learned from industry insiders that Capcon (Huafeng Technology) has obtained a large-scale equipment purchase order from Riyueguang Kaohsiung Factory. This time, the equipment purchased by Sun Moonlight is the wafer-level packaging and placement machine AvantGo2060W. The AvantGo 2060W is "bright when it comes out", and the device has been favored by the sun and moonlight since its introduction. Up to now, Capcon's advanced packaging equipment has provided production capacity for Sun Moonlight for many years.
Wafer-level package mounter AvantGo 2060W
From a technical point of view, advanced packaging is considered to be a subversive technology in the post-Moore era, in the many technologies of advanced packaging, wafer-level packaging to wafer as the processing object, with low cost, good heat dissipation performance, small size, batch processing and other advantages, mainly used in portable products such as smart phones. Wafer-level packaging (WLP) technologies include wafer-on-chip packaging (WLCSP), Fan-out Wafer Level Packaging (FOWLP), wafer packaging and thin film capping on MEMS devices, wafer packaging with pass-silicon Via (TSV), wafer packaging with integrated passive devices (IPD), and wafer packaging with fine traces and embedded integrated passive devices. Among them, the Fan-out process and technology is the basis of advanced back-end integration, and will become the driving force for the future of the microchip type heterogeneous integration, Fan-out process also has greater technical difficulty, usually need to rebuild the wafer, this process requires very accurate positioning of the tested chip on the carrier wafer / panel, because the subsequent mask alignment wafer and exposure are one-time, so the accuracy requirements for the chip position are very high, and the chip Pick and must be maintained The position on the Place carrier does not shift, the accuracy and stability of the chip equipment are very high, in order to ensure the efficiency of the package, the wafer reconstruction process in the process of ensuring accuracy at the same time also need a high UPH.
Capcon Wafer Level Packaging Placement Machine AvantGo 2060W support process includes WLFO, InFO, COWOS, M-seris, eWLB, 2.5D/3D-TSV, which has ultra-high precision multi-bond coupling, accuracy up to +/-5um@3 σ, high-precision mode can reach +/-3um@3 σ (single-head working mode); supports up to 70mm chip front and back mounting, Face up/Face Down is freely switchable and supports robotic arms (Cassette, Foup), Wafer, tape tray, waffle tray feeding device. The production capacity is 5000-11500pcs per hour, and the UPH is up to 12k (Face up).
As a high-end equipment manufacturer focusing on the field of advanced packaging equipment, Capcon (Huafeng Technology) is committed to providing customers with advanced semiconductor packaging product technology and solutions, advanced packaging patch process coverage (FCCSP/BGA, WLFO, 2.5/3D, SIP, PLP, SD), the company's advanced packaging chip equipment products are a collection of hundreds of strengths, with high speed, high precision, high stability, customizable product characteristics. In particular, it has a mature product line in advanced packaging equipment such as Flip Chip flip chip, Fan-Out fan-out wafer level chip package, 2.5D/3D package, sip integrated package and so on.
From the market level, since its establishment in 2014, Capcon's mature equipment product line has been recognized by internationally renowned semiconductor packaging and testing manufacturers, and has established lasting cooperative relations with head manufacturers, and has quickly ranked among the top three suppliers of advanced packaging equipment in the world. The customers served are Sun Moonlight, Silicon, Changdian Technology, Tongfu Microelectric, Yuemo Advanced, DeeTee, Nepes, TRS, Huatian Technology, Tongfu AMD, etc.; terminal IC customers include Broadcom, Qualcomm, MediaTek, Nvidia, Texas Instruments, Sony, Qorvo, etc. It is worth mentioning that at present, Huafeng's domestic orders are also growing rapidly, and in the mainland market, it has obtained bulk orders from a number of head customers.
At present, Moore's Law is approaching the limit, and semiconductor industry players are turning their attention to improving the chip architecture, so that the chip from the traditional single layer to the multi-layer stack, and because of this, advanced packaging is the key to the next stage of manufacturers' technological progress competition. At the same time, with the popularization of high-tech applications such as AI and 5G, the demand for high-end chips will increase day by day, and 2022 will be the explosive year of advanced packaging. As a result, wafer-level packaging is expected to maintain a steady growth trend in the coming years due to its advantages in reduced product size, chip embedding flexibility, and electrical performance.
It is understood that as of now, the company's order volume in Q1 of 2022 has reached 50% of the order volume in 2021. Overall, Capcon (Huafeng Technology) has been tested by the technical certification of many head packaging and testing manufacturers around the world, and has been recognized by end customers. With the rapid increase in the proportion of advanced packaging in semiconductor manufacturing, Capcon will also usher in large-scale market growth.