HiSilicon faded out, the five major oligopolies cut the chip design, stacked packaging can help Huawei break the game?

The ancient palace is few and far away, and the palace flowers are lonely and red. The white-headed palace lady was there, sitting idly and saying Xuanzong. The mighty river of time washed away all kinds of lead and brought all kinds of things that were not human. Once the heyday of the New Century, how could he have imagined that he would face the lonely and lonely Palace now. Also now, because of the united States' revision of the rules, HiSilicon, who once shined in the field of chip design with the help of Kirin.

Now, ushered in a different scene, a new data came out, chip design is basically divided by the five major oligarchic enterprises, no longer see HiSilicon figure. As we all know, Huawei HiSilicon's progress in chip stacking packaging is also not small, so can entering the chip stacking, can it prompt Huawei HiSilicon to return to the peak of the chip design field, in the coming days, does Huawei HiSilicon have other possibilities to break the game?

Chip design is divided into five worlds, and HiSilicon is not involved in it

On May 6 this year, the latest chip design company revenue ranking was released, in 2018, that is, when the United States has not yet modified the rules, Huawei HiSilicon is operating normally, and it can also rush into the top five in the world with a revenue of 7.573 billion US dollars, but the United States has a paper rule, in the case of HiSilicon is difficult to ship, the original fifth place throne is directly ranked behind Huawei HiSilicon AMD.

Then last year was basically the same, the chip design company revenue ranking is still Qualcomm, Nvidia, Broadcom, MediaTek, AMD these five companies, why do you say that the chip design market is basically divided by these five companies? You know, these five companies Qualcomm has the highest revenue, $29.333 billion, and even the fifth-place AMD has $16.434 billion. But starting from the sixth place, it is basically thirty or forty, one or two billion dollars, and compared with the top five, the gap is still relatively large.

So, what about Huawei, which was once in the top five? At present, it has long faded out of the ten. However, Huawei did not give up, did not lie flat, and found a stage for itself to show its skills in terms of chip stacking.

Huawei announces a chip stacking patent

Also on May 6, according to national intellectual property information, Huawei disclosed a patent on "chip stacking packaging structure and packaging methods, electronic devices" on the same day, which mainly involves the field of electronic stacking technology, mainly to explore how to reliably bond multiple sub-chip stacking units to the same main chip stacking unit, which can also be called "multi-core superposition".

Huawei's announcement of this patent shows that Huawei should have made great achievements in chip stacking, and should also have made a breakthrough. So, now that Huawei is entering chip stacking, is there any hope of making Huawei HiSilicon return to the top five?

Can entering the chip stacking make Huawei HiSilicon return to the peak?

Huawei's entry into chip stacking, I am afraid it is difficult to make Huawei HiSilicon back to the peak, one is because the competition in this field is still very fierce, in foreign countries, on December 13 last year, held in San Francisco, usa, a semiconductor conference, Intel in order to catch up with Samsung and TSMC, announced 3D stacked transistor technology. In China, on December 3 last year, Alibaba officially announced that Alibaba's Dharma Academy has successfully developed the world's first DRAM-based 3D bonding stacking and storage integrated chip.

It can be seen from this that if Huawei wants to enter the chip stack, the domestic and foreign market competition is still relatively fierce, Huawei's competitive pressure is still relatively huge, Huawei HiSilicon enters the chip stack, and if you want to make yourself back to the peak, I am afraid it is still a little difficult.

On March 2 this year, Intel, AMD and other global ten enterprise giants established the UCIe Alliance, ready to establish an open, interoperable standard to be used for multiple chips in the form of advanced packaging.

Stacking is actually a way of chip packaging, and the global top ten giants are grouped together, and it may not hinder the pace of Huawei HiSilicon's return to the peak. In general, entering the chip stacking is not necessarily the best choice for Huawei HiSilicon to return to the peak of the chip design field, so, in terms of actual conditions, does Huawei HiSilicon have other possibilities to break the game?

Is there any other possibility for Huawei HiSilicon to break the game?

Huawei HiSilicon actually has other possibilities to break the game, why Huawei HiSilicon can not ship, why will it fall into such a situation today, not because of 5G chips, why 5G chip research and development will be a problem, in fact, in the final analysis is not because of the lack of 5G RF chips, and in terms of RF chips, on January 11 this year, the domestic manufacturer Fumanwei said on the investor interactive platform that 5G RF chips have achieved mass production, and on March 24 this year, it is further expressed that it can support all mobile phones and module platforms.

With the breakthrough of domestic manufacturers in RF chips, the future localization should also be just around the corner, how can Huawei HiSilicon not have the possibility of breaking the situation?

In addition, SMIC, the leader of the mainland chip foundry enterprise, under the leadership of Dr. Liang Mengsong, has successfully realized the mass production of chips with advanced processes such as 7nm, N+1, etc. Huawei HiSilicon can cooperate with its own advanced stacking technology, and may not be able to make the chip performance reach 1+1 greater than 2.

summary

Under the modification of the US rules, Huawei HiSilicon has no chance of the top five, under the division of the five major oligarchs, with chip stacking, Huawei is afraid that it will be difficult to break the game, but Huawei is actually not only chip stacking, in fact, there are many possibilities of breaking the game, I hope that Huawei can continue to adhere to the development in the future days, I believe that in the near future, Huawei HiSilicon's Kirin can once again stand proudly on top of the world.