After the rules such as chips were revised, Huawei's business has been greatly affected, among which HiSilicon Semiconductor's share in the global chip market has declined significantly, and it has fallen out of the ranking of the world's top 25 semiconductor suppliers.
In the latest report, HiSilicon's revenue fell from $8.2 billion in 2020 to $1.5 billion in 2021, a sharp drop of $6.7 billion, which is a direct result of the US revision of chip rules.
After HiSilicon Semiconductor was affected, Huawei's smartphone business also fell sharply, and the revenue of the consumer business segment fell from more than 480 billion yuan in 2020 to more than 240 billion yuan in 2021, about halving, so the impact on Huawei in 2021 is very obvious.
However, in 2022, the situation is changing, Huawei's determination does not seem to have changed, and some foreign media have also reported that Huawei is getting out of the predicament and believes that there will be chips soon.
Foreign media have such a view because Huawei has made a comprehensive layout, and in 2021, hubble investment company will be established to increase investment in materials, equipment, RF chips, optoelectronic chips, EDA software, filters, sensors and other segments.
According to incomplete statistics, in the past year, Hubble Investment has invested more than 70 times and invested in more than 60 companies, and these industrial layouts will definitely make Huawei have stronger strength in the semiconductor field.
After entering 2022, Huawei's actions continue to appear, not only upgrading HiSilicon Semiconductor from a secondary department to a first-level department, but also in just a few months, Huawei has issued 17 billion yuan of bonds, which will be used for the company's daily operations.
It should be known that Huawei's annual R& D investment is as high as hundreds of billions of yuan, and the issuance of 17 billion yuan of bonds may be to continue to increase the size in the semiconductor field, in order to get rid of the continuous impact caused by the US revision of chip rules as soon as possible.
In addition to continuing to increase investment in the semiconductor field, Huawei also announced the technical patents related to stacked chips some time ago, which can not only reduce costs, but also greatly improve the performance of chips, and this scheme of stacking and area for performance has also been confirmed by Apple.
Previously, Apple released the M1 Ultra chip, which is spliced by two M1 Max chips through glue, so it has doubled in performance, indicating that the solution of exchanging area for performance is feasible.
On the other hand, TSMC has also launched advanced 3D packaging technology, which can exert the 7nm process to the extreme, the same is the 7nm process chip, the chip performance using 3D packaging will be increased by more than 40%, which shows that the stacking scheme is also feasible.
In this way, Huawei's stacked chips are expected to reach the usable level even if they do not use TSMC's advanced technology, and Huawei's comprehensive layout of the semiconductor industry is also to achieve a breakthrough as soon as possible to break the restrictions of the United States.
It is worth mentioning that HiSilicon chip is not only developing mobile phone chips, but also has made a breakthrough in car specification chips, and its self-developed vehicle specification-level chips have been applied to some intelligent networked cars, which is also a blue ocean in the future.
Then there is the United Nations manufacturers to achieve 5nm chip packaging in the country, based on the open source architecture RSIC-V research and development of CPU applications in TV products, HiSilicon self-developed screen driver chip has also been in the relevant test.
Combining the above changes, there is a view that foreign media believe that Huawei is getting out of the predicament, and believe that Huawei will soon have a chip, and perhaps soon after, Huawei's Kirin mobile phone chip will also return strongly. What do you think about this, welcome to comment, like, share.