Huawei released its 2021 annual report this week, and judging from Huawei's latest business architecture in 2021, HiSilicon has been independent from the second-level department under the 2012 lab and has become a first-level department alongside Huawei's cloud computing and intelligent vehicle solution BU.
2021 Huawei Business Architecture Diagram
2020 Huawei Business Architecture Diagram
According to Huawei's 2021 annual report, HiSilicon is positioned to provide end-to-end board-level chip and module solutions such as perception, connectivity, computing, and display for intelligent terminals, display panels, home appliances, and automotive electronics, and undertake responsibilities for R&D, Marketing, ecological development, sales and service in the chip and module industries, and be responsible for business results, risks, market competitiveness, and customer satisfaction.
At the launch of Huawei's 2021 annual report, when talking about chip supply-related issues, Guo Ping, Huawei's rotating chairman, said in an interview with the media that solving the problem of the entire semiconductor is a very complex and lengthy project that requires patience. In a global context, the repeated development of these technologies does not necessarily have commercial value. But in the case of market patterns and technological blockades, new demand will arise, and investments in this area will become commercially valuable. We believe and would love to see more and more companies participate in this market and would love to see their success. In the case that today's process is not available and single-point technology encounters difficulties, we are actively looking for a breakthrough in the system. The future chip layout, our main communication products use a multi-core structure, supporting the reconstruction of the software architecture and the multiplication of performance, it should be said that it is equivalent to injecting new vitality into the chip, which can enhance our continuous supply capacity.
Guo Ping also admitted that the us for many years of sanctions has caused Huawei very great difficulties, especially the mobile phone business among consumers, because the chips of mobile phones need to have strong computing power, low power consumption and small size, and we still have difficulties in obtaining them. While actively discussing sustainable solutions for mobile phones with all parties concerned, we are also expanding some new areas such as wearables, sports health, whole house intelligence, etc. Wearables and other products have achieved very rapid development, and we are also looking for new development opportunities in these new scenarios.
It is understood that despite the difficulties, HiSilicon is still recruiting talents to invest in technology research and development in the near future. Since the end of last year, Huawei's HiSilicon Semiconductor & Devices Business Department has opened the 2022 campus recruitment, including Shenzhen, Shanghai, Beijing, Nanjing, Hangzhou, Xi'an, Dongguan, Wuhan, Chengdu, Suzhou, etc., and the recruitment positions involve chip and device design engineers, software development engineers, hardware technology engineers, AI engineers, algorithm engineers, etc. (C114 Andy)