April 17 news, according to gartner released the 2021 global semiconductor research report, due to the US trade sanctions, affecting China's overall share of the global chip market, Huawei HiSilicon has fallen out of the world's top 25 semiconductor suppliers ranking.
Huawei HiSilicon revenue fell 81%!
Andrew Norwood, Research Vice President of Gartner, said in the report: "HiSilicon's revenue fell by 81%, from $8.2 billion in 2020 to $1.5 billion in 2021, a significant decrease of $6.7 billion. This is a direct result of the U.S. sanctions against the company and its parent company Huawei. ”
According to gartner reports, the top ten semiconductor industries in 2021 are: Samsung Electronics, Intel, SK Hynix, Micron Technology, Qualcomm, Broadcom, MediaTek, Texas Instruments, Nvidia, AMD.
Samsung Electronics has regained the top spot in the semiconductor supplier list from Intel for the first time since 2018, with Samsung's chip revenue totaling $73.2 billion in 2021, accounting for 12.3% of the global market share, while Intel reported sales of $72.5 billion, accounting for 12.2% of the global market share.
In contrast, Samsung's surpassing Intel this time is not large, only less than one percentage point.
The third place, SK Hynix, will only have about half of Intel's operating income in 2021, and its market share will be only half of Intel's.
In terms of growth rate, HiSilicon's competitors Qualcomm and MediaTek have achieved sharp increases, with growth rates of 53.4% and 60.2% respectively.
But AMD's growth rate was the highest, reaching 68.6%, followed by MediaTek, Qualcomm, and SK Hynix.
Gartner data also shows that global semiconductor revenue totaled $595 billion in 2021, up 26.3 percent from 2020.
"The current chip shortage continues to affect original equipment manufacturers (OEMs) around the world, but the volume of 5G smartphones and strong demand and rising logistics/raw material prices have combined to drive higher average selling prices (ASPs) for semiconductors, contributing to a significant increase in revenue in 2021," Andrew Norwood said.
Meanwhile, South Korea saw the largest increase in global market share last year, as strong growth in the memory market pushed the country's overall share of the global semiconductor market to 19.3 percent.
According to Norwood, HiSilicon's share of sanctions has also had an impact on China's global semiconductor market, with China's market share falling from 6.7% in 2020 to 6.5% last year.
Reproduce the rumors of Huawei employees jumping jobs to OPPO
At the same time as Huawei's HiSilicon revenue plunged, there was another news: "According to foreign media reports, although Huawei has not announced any major layoffs from HiSilicon, its employees are highly sought after by other IC design companies in the mainland." According to people familiar with the matter, some employees have jumped to work at Zeku, the chip design department of smartphone giant OPPO in Shanghai (source: Leifeng Network). In this regard, some netizens also questioned, is there no confidentiality agreement and non-compete agreement? Can I jump ship at will?
In fact, this is not the first time that There are rumors of Huawei HiSilicon employees jumping jobs oppo, in 2020, a person who called himself a "former ZTE employee" on the Pulse App said: "Recently oppo came to HiSilicon to dig people, interviews are not used, directly multiplied by an annual package coefficient to enter the job... Also opened a branch center in Xi'an, digging wildly! ”。
Subsequently, OPPO Guangdong Mobile Communication Co., Ltd. entrusted the law firm to issue a lawyer's letter, saying that "after verification, the information is purely fabricated, unfounded, and has a serious negative impact on the client and the reputation of the OPPO brand."
This year, HiSilicon's "strategic" position within Huawei has been further enhanced.
Affected by US sanctions, China's chip industry has been greatly impacted, and at the same time, it has forced the domestic chip supply chain to seek self-improvement.
Among them, HiSilicon is placed high hopes. Judging from Huawei's recent actions, Huawei not only did not give up HiSilicon, but also released a positive signal in the field of Huawei's chip.
On March 29, 2022, Huawei listed its latest business architecture diagram in its annual report.
As can be seen from the figure, HiSilicon was independent from the second-level department under the 2012 laboratory and upgraded to huawei's first-level department, which is tied with Huawei's cloud computing, intelligent vehicle solution BU operator BG, enterprise BG, terminal BG, digital energy, ICT products and solutions.
In addition, in 2021, in addition to picking out HiSilicon alone, Huawei also removed the original consumer BG, which was responsible for multiple departments such as terminal BG and Huawei cloud computing, and made a series of adjustments to the functional platform.
According to public information, the main carrier of Huawei's R&D system was Huawei's 2012 laboratory, which consisted of secondary departments such as Academia Sinica, Central Software Institute, Central Hardware Institute, and HiSilicon Semiconductor. However, although HiSilicon is nominally a second-level department, it has a very high internal status.
Huawei insiders have revealed that HiSilicon's position is superior, in fact, it is a first-level department, and it basically cannot manage it in 2012. He Tingbo is not only the president of HiSilicon, but also the president of 2012, and she is also one of the board members of Huawei, which is higher than the boss of some first-level departments.
Previously, Xu Zhijun, huawei's rotating chairman, said that HiSilicon is a chip design department in Huawei, not a profitable company, and there is no demand for profitability for it. Now it's time to keep this team and keep going, as long as we can afford it. This team can continue to research, develop and prepare for the future.