On April 5, 2022, the Juice Bureau publicly announced the chip stacking package patent of Huawei Technologies Co., Ltd. It has attracted the attention of the industry.
summary
A chip stacking packaging and terminal device involving the field of semiconductor technology, which can ensure the demand for power supply while solving the problem of high cost caused by the use of silicon through-hole technology. The chip stack package (01) comprises: a first chip (101) and a second chip (20) disposed between the first trace structure (10) and the second trace structure (20); the first chip (101) of the active side (S1) facing the second chip (102) of the active plane (S2); the first chip (101) of the active surface (S1) comprising a first overlapping region (A1) and a first non-overlapping region (C1), the active surface of the second chip (102) (S2) Includes the second overlapping region (A2) and the second non-overlapping region (C2); the first overlapping region (A1) overlaps with the second overlapping region (A2), the first overlapping region (A1) and the second overlapping region (A2) are connected; the first non-overlapping region (C1) is connected to the second trace structure (20); the second non-overlapping area (C2) is connected to the first trace structure (10).