According to public information, Huawei announced a patented technology called "a chip stacking packaging and terminal device". The abstract introduces that this involves the field of semiconductor technology, which can ensure the power supply demand and solve the problem of excessive cost caused by the use of silicon through-hole technology.
According to the Tianyancha App, recently, Huawei Technologies Co., Ltd. "a chip stacking packaging and terminal equipment" patent was announced.
The patent abstract shows that the present disclosure is a chip stacking packaging and terminal device, involving the field of semiconductor technology, which can ensure the demand for power supply while solving the problem of high cost caused by the use of silicon through-hole technology.
The application date for this patented technology is September 30, 2019, and it was not officially announced until April 5 this year. This is the third year, which shows that Huawei did not start developing this technology on a whim.
As early as a few years ago, it has been prepared, and with huawei announcing the chip stacking patent, it is not excluded that there will be a possibility of related actions in the future.
Perhaps it is based on this technology for the actual product landing, or it may still be in the stage of technology accumulation, and then carry out follow-up actions when the domestic independent industrial chain matures. Therefore, it is not yet certain what actions Huawei will take based on this technology, but it can be confirmed that Huawei is not a blank space regarding chip stacking technology.
The chip stack package (01) comprises: a first chip (10) and a second trace structure (20) disposed between the first chip (101) and the second chip (102); the first chip (101) of the active side (S1) facing the second chip (102) of the active plane (S2); the first chip (101) of the active surface (S1) comprising a first overlapping region (A1) and a first non-overlapping region (C1), The active surface (S2) of the second chip (102) comprises a second overlapping region (A2) and a second non-overlapping region (C2); the first overlapping region (A1) and the second overlapping region (A2) overlap, the first overlapping region (A1) and the second overlapping region (A2) connected; the first non-overlapping region (C1) is connected to the second trace structure (20); the second non-overlapping region (C2) is connected to the first trace structure (10).
Therefore, the choice of chip stacking technology, both to ensure performance improvement, but also to ensure stable power consumption, in special application scenarios, can not overly occupy the equipment area, so as not to affect the function of other devices. This depends on the specific actual situation, to see which scenarios Huawei intends to apply chip stacking to. If it is a mobile phone processor, I am afraid that it will not be able to make a big breakthrough for a while and a half.