A Qualcomm fire dragon that came out of nowhere has caused waves of public opinion, and I don't know when everyone is spitting on this Qualcomm Snapdragon 8 Gen 1. Have you ever thought that this chip is already a mature 4nm process, and at present, there is not much room for development in the advanced process of chips.
In order to break the limits of Moore's Law, in order to achieve their own development and break the game, global companies have set their sights on advanced packaging. Huawei, which has always wanted to achieve a breakthrough, is naturally no exception, and has announced its own chip stacking patent. So, is there any hope for the breakthrough of Huawei chips? Does achieving such results really mean that the future can really sit back and relax?
Huawei's chip stacking patent was released
According to national patent information, Huawei disclosed a technology patent on April 5, which mainly involves chip stacking packaging and terminal equipment. So, where are the highlights of Huawei's patent? In fact, it is in the case of ensuring the power demand, but also solving the problem of the cost of the package chip caused by the previous chip stacking due to the use of silicon through-hole technology.
I have to say that Huawei's own scientific research strength is really strong, even in the new track of chip packaging, Huawei can also have
Kind of achievements and strength. With the release of Huawei's patent, there is finally hope for Huawei's chip to break the game.
Huawei's chip is expected to break the game
Huawei has now made such achievements in advanced packaging, obtained such patents, and solved the technical problems of Huawei's packaging chip, and in terms of equipment, although Apple's M1 Ultre chip is assembled from two high-end M1 chips, even if it is not used for high-end chips, it may not be impossible to package advanced.
Therefore, the release of Huawei's patent can undoubtedly get rid of the card neck brought by advanced equipment, and the breakthrough of Huawei chips is naturally promising. In addition, why can't Huawei break the game in terms of chips? In fact, I personally feel that the fundamental reason is that Huawei's 5G mobile phone business is temporarily shelved, and that Huawei does not have many 5G chips in its hands.
It is such a small number of 5G chips, Huawei can not do the full use, before the use of Dingqiao communications, the whole backdoor listing, March 31, there are relevant digital bloggers revealed that Huawei equipped with Kirin 9000 4G chip Mate X3, this model has passed the Ministry of Industry and Information Technology network access review may be released at the end of April.
Why can't Huawei make the most of the 5G Kirin chip? It's not because of the obstruction of American technology. Nowadays, Huawei has its own chip stacking patents, and there is also corresponding localization support in terms of equipment, and in the future, Huawei chips are actually expected to break the game.
In short, Huawei has this chip stacking patent, in the chip packaging has become a new trend today, for Huawei, for Huawei chips, the benefits are innumerable, it goes without saying, Huawei's development potential in chip stacking, chip packaging is also huge.
The strong strength of chip packaging is also crucial for Huawei's chip to break the game, then, in today's Huawei has such a strong strength in chip stacking technology, in the future days, can Huawei really sit back and relax?
Huawei cannot be taken lightly
In the days to come, Huawei naturally cannot sit back and relax, let alone take it lightly. At present, the advanced process of chips is about to reach the limit of Moore's Law, which has long been a public fact, and many companies around the world are also entering chip stacking and entering chip packaging.
On August 31 last year, according to relevant industry insiders, TSMC has launched a new advanced packaging technology CUPE heterogeneous integration technology for the data center chip market, on March 31 this year, according to relevant Taiwan media reports, TSMC Zhunan Advanced Packaging and Testing Plant AP6 will be mass production in the third quarter of this year, not only to enter the 2D\2.5D package, but also to promote large-scale 3D more advanced packaging mass production plan.
In 2018, at that year's Architecture Day, Intel also unveiled The Coveros 3D packaging technology, a new packaging technology that extends chip stacking from stacked memory and passive adapter boards to high-end performance logic chips. It is not difficult to see from this that although the chip stacking field is very new, there are also many competitors, there is no small competitive pressure, in such a situation, how can Huawei take it lightly?
In addition, hindering Huawei's advanced stacking and advanced packaging development, there is actually an unstable factor in the United States. Why the United States should change the rules is not to maintain its own greatness and prevent enterprises from other countries from getting involved in the United States' position as the world's number one. Will the United States allow Huawei to continue to develop and progress on advanced stacks and advanced packages, obviously not? Therefore, Huawei still cannot be taken lightly. Huawei still has a long way to go.
summary
Chip stacking, in today's shrinking development space of advanced packaging, has undoubtedly become the object of competition and thousands of sails for global chip-related enterprises. Huawei, with its unremitting efforts, has never given up, never give up the spirit of never giving up, and finally won such an impressive patent in the field of chip packaging, and achieved such a huge breakthrough, which is really gratifying.
It is hoped that Huawei will continue to work hard in the field of advanced chip packaging in the future, and strive to use the help of this patent as soon as possible to stack chips and package them into a visible and tangible reality. Ahead, it may be very long, maybe thorns everywhere, but I believe that Huawei can finally cut through the thorns and create brilliant again.