Source: Juheng Network
TSMC Zhunan Advanced Packaging and Testing Plant AP6 will be in mass production from the third quarter of this year, because in addition to the existing 2D/2.5D package, there will also be a large-scale 3D package mass production plan, the industry is closely following the market reaction after the mass production, and observe the future market trend.
In the past few years, TSMC's advanced packaging technology, both InFO and CoWoS, has grown steadily, among which 2.5D InFO has become the main source of revenue for TSMC's advanced packaging with the increase in sales of Apple's A-series mobile phone processors, estimated at about 70%.
With the recent rise of AI and HPC applications, CoWoS has grown more than InFO, coupled with the previous TSV technology, the use of thicker copper connections, so that CoWoS has more advantages, but also adopted by AMD, driving CoWoS to account for 30% of the overall advanced packaging revenue, diversifying the risk of product concentration.
In order to continue Moore's Law, TSMC also launched the 3D Fabric platform the year before, through the silicon stack in the front of the 3D package and the advanced packaging technology at the back end, to strengthen the architecture elasticity, improve efficiency, shorten the time to market and cost-effectiveness, etc., in order to meet the future needs, it also built a new Zhunan plant AP6, mainly to provide SoIC, WoW technology.
The industry is also waiting for the market reaction of TSMC after the mass production of 3D packages this year, such as customer base and application expansion, the primary target is the existing customers, not only upgrading existing products from 2.5D to 3D packaging processes, but also changing more products from 2D to 2.5D packages.
In addition to existing customers, as the major brands have jumped into the ranks of independently designed chips, the outside world has also observed whether it can attract stronger new customers to join the ranks of 3D packaging, which will help TSMC's advanced packaging revenue scale and sales unit price to increase, and the demand for machinery and equipment will also increase, showing a positive cycle for Taiwan's equipment factories.
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