Jiwei Network News (Text/Wu Jiaxi) On January 15, Shenyang Xinyuan Microelectronic Equipment Co., Ltd. (hereinafter referred to as "Xinyuan Micro") submitted a registration to the Shanghai Stock Exchange on the "issuance of A-share shares to specific targets to raise funds".
It is understood that the industry of The Core Source Micro is the semiconductor special equipment industry, mainly engaged in the research and development, production and sales of semiconductor special equipment, including lithography process glue development equipment (glue /developer, spray machine) and monolithic wet equipment (cleaning machine, glue removal machine, wet etching machine), which can be used for 8/12 inch single wafer processing (such as integrated circuit manufacturing before the wafer processing and post-channel advanced packaging link) and 6 inches and below single wafer processing (such as compounds, MEMS, LED chip manufacturing and other links).
The glued developing equipment products produced by the core source micro-production have successfully broken the monopoly of foreign manufacturers and filled the domestic gap, among them, in the front of the integrated circuit wafer processing link, as a localization equipment has been gradually verified, to achieve small batch substitution; in the integrated circuit manufacturing after the advanced packaging, compound, MEMS, LED chip manufacturing and other links, as the mainstream model of domestic manufacturers has been widely used in the domestic well-known large factories, successfully realized import substitution.
For the future development strategy, Core Source Micro said that it will consolidate the traditional advantages and expand the scale of market sales. In the field of advanced packaging and LED chip manufacturing in the field of integrated circuit manufacturing, Xinyuan Micro has been deeply engaged in the field of integrated circuit manufacturing for many years, and has established a certain industry reputation with continuous technological innovation, high-priced products and high-quality after-sales service. For the field of advanced packaging after integrated circuit manufacturing, in order to adapt to the development trend of advanced packaging technology, Core Source Micro will be committed to developing multi-layer stacked multi-cavity equipment, enriching core source micro product lines, enhancing product competitiveness, and expanding market sales scale. In the field of LED chip manufacturing, Chip Source Micro grasps the development direction of the LED chip industry, actively launches semiconductor equipment suitable for emerging fields, continues to keep up with the development trend of the industry, continuously introduces products that adapt to new technologies in the LED industry, and continues to promote the increase of chip micro's market share in LED chip manufacturing and other fields. In addition, The Core Source Micro will actively establish an overseas sales system, cultivate and expand overseas markets, enhance the international influence of the Core Source Micro brand, and create new growth points for the development of The Source Micro.
The gluing developing equipment and monolithic cleaning equipment suitable for the front-channel wafer processing process have been verified and put into use by customers in specific processes. Next, Singyuanwei will further enhance the technical level of such equipment, and at the same time do a good job in downstream market development and customer service to enhance the recognition and penetration rate in the downstream market to help the mainland Qiandao wafer processing equipment localization rate continue to increase. The construction of the semiconductor equipment industry chain in mainland China is still in its infancy, a large number of core components of domestic semiconductor equipment are still dependent on imports, and The core source micro will reduce the cost of core components through joint development, independent research and development, and find alternative suppliers, consolidate the controllability of core components, and enhance the comprehensive competitiveness of products.
It is planned to raise 1 billion yuan for the construction of projects such as R&D and industrialization in Shanghai Lingang
It is reported that the Shanghai Lingang R&D and industrialization project is located in the Lingang Park of Shanghai Minhang Economic and Technological Development Zone. The project is expected to have a construction period of 30 months and will be implemented by Shanghai Core Source Micro Enterprise Development Co., Ltd., a wholly-owned subsidiary of Core Source Micro. The total planned investment of this project is 640 million yuan, and it is planned to invest 470 million yuan in funds raised, and the rest will be self-raised. After the completion and production of this project, it is mainly used for the development and production of high-end semiconductor special equipment such as the pre-road ArF lithography process glue developer, the immersion lithography process glue developer and the monolithic chemical cleaning machine.
The high-end wafer processing equipment industrialization project (Phase II) is located in Hunnan District, Shenyang City, Liaoning Province. The project is expected to have a construction period of 30 months, with a total planned investment of 289.3927 million yuan, and it is planned to invest 230 million yuan in raised funds, and the rest will be self-raised. After the completion and production of this project, it is mainly used for the front road I-line and KrF lithography process glue developer, the front road Barc (anti-reflective layer) glue applicator and the rear road advanced encapsulation Bumping preparation process glue developer.
In addition, in order to meet the growing operating capital needs of SYSV Micro, 300 million yuan of the raised funds is intended to be used to supplement the working capital. The raised funds will be used to support the continuous launch of new products and meet the expansion needs of the core source micro industry.
(Proofreading/Andy)