【Jiaqin Comment】The display panel equipped with micro-LED chip invented by Chenxian Optoelectronics and its preparation scheme realizes the color conversion by setting a color conversion layer on the side away from the LED substrate, and aligns the substrate and the TFT backplane to improve the stability of material binding in high-temperature environments.
Micro-LED (micro-light emitting diode, micro LED) is a new generation of display technology, compared to the existing OLED technology, this micro LED display has higher brightness, better luminous efficiency, and lower power consumption, very suitable for application in high-end electronic digital products.
In the current traditional technology, the micro LED display panel usually uses a micro LED chip to emit emitted light, and then the outgoing light is color converted to obtain a tri-color light. However, the display effect of this traditional technology in the actual implementation process is poor, and it cannot play its excellent functional characteristics.
Therefore, on May 14, 2020, Chenxian Optoelectronics applied for an invention patent entitled "Display Panel and Preparation Method thereof" (application number: 202010409811.2), and the applicant was Chengdu Chenxian Optoelectronics Co., Ltd.
In this patent, a new type of microLED display panel preparation scheme is invented, which can effectively complete the conversion of specific colors. According to the relevant information currently published in the program, let's take a look at this invention patent.
As shown above, for the invention of the patent in the display panel preparation process flow schematic diagram, the preparation of this display panel selects the LED substrate as the backplate, the substrate includes a backplane 110 and led chip 120, LED chip spacing is provided on the TFT backplane, and the LED chip is a microLED chip, which can emit light under the drive of the TFT circuit, usually the size is between several microns and tens of microns.
First of all, after the LED chip is grown on the growth substrate, the LED chip is first adhered to the temporary substrate, and then the growth substrate is removed by laser peeling and other methods, so as to form a discrete LED chip array on the temporary substrate. Then the LED chip is picked up by the transfer head, moved to the TFT backplane, and cured the connection between the LED chip and the TFT backplane by means of heat soldering.
Secondly, on the transparent first substrate 130 to form a reflective layer 140 and a first barrier layer 150, the first barrier layer is provided with a plurality of first storage cavities. When the LED chip emits blue light, the reflective layer can selectively transmit blue light, that is, the reflective layer can only transmit blue light, while reflecting other colors of light.
Finally, the first substrate and the LED substrate are laminated, so that the first barrier layer is provided between the TFT backplane and the first substrate, the LED chip is set in the first storage cavity, and the orthographic projection of the LED chip on the first substrate and the reflective layer on the first substrate overlap, so that the first substrate is far from the LED substrate on the side of the color conversion layer, thereby realizing the conversion of blue light colors.
In the above figure, a schematic diagram of the cross-sectional structure of such a display panel is shown, it can be seen more clearly that the display panel comprises an LED substrate 100, a first substrate 130, a first barrier layer 150 and a reflective layer 140. On the first substrate is provided with a first surface 132, which is close to the TFT backplane, there is a reflective layer on the first surface, the reflective layer is a distributed Bragg reflective layer, which includes a plurality of reflectors 142, these reflectors are stored in the first storage cavity. Therefore, the uniformity of the thickness of the reflective layer film is improved by the lamination of the substrate and the backplate of the TFT, and the high temperature affects the stability of the TFT backplate when preparing the first barrier layer.
The above is the display panel equipped with microLED chip invented by Chenxian Optoelectronics and its preparation scheme, which gets rid of the traditional technology that requires the color conversion of the emitting light of the microLED chip, and realizes the color conversion by setting the color conversion layer on the side away from the LED substrate, and the substrate and the TFT backplane are aligned to improve the stability of the material binding at high temperatures, thereby effectively improving the display effect of the display panel.