Jiwei Network news, on the evening of February 22, the announcement of the results of the 11th review meeting of the Listing Committee of the Science and Technology Innovation Board in 2022 showed that Yongsi Electronics (Ningbo) Co., Ltd. (hereinafter referred to as Yongsi Electronics) has been launched on the Science and Technology Innovation Board on February 22.
It is understood that Yong Silicon Electronics was established in November 2017, the company from the beginning of its establishment has focused on the advanced packaging field in the integrated circuit packaging and testing business, workshop cleanliness level, production equipment, production line layout, process route, technology research and development, business team, customer introduction are oriented to advanced packaging business, during the reporting period, all the company's products are in the form of high-end advanced packaging, packaging products mainly include "high-density fine-pitch bumping point flip-up products (FC products), system-level packaging products (SiP), Flat leadless package products (QFN/DFN) and microelectromechanical system sensors (MEMS) are divided into 4 categories, with 9 main package formats, totaling more than 1900 product varieties.
At present, Yongsi Electronics has established stable cooperative relations with hengxuan technology, Jingchen shares, Fuhan micro, MediaTek, Beijing Junzheng, Xinchuang Technology, Quanzhi Technology, Huiding Technology, Weijie Chuangxin, Shenzhen Feijun, Aojie Technology, Ruishi Chuangxin, Onrui Micro, Xiamen Xingchen and other well-known IC design enterprises in the industry.
From 2018 to 2020, Yongsi Electronics achieved operating income of 38.5443 million yuan, 365.7717 million yuan and 748.0055 million yuan respectively, and the net profit attributable to the owners of the parent company in the same period was -39.0473 million yuan, -39.6039 million yuan and 27.8514 million yuan, respectively.
From 2018 to 2020, yongsi electronics R & D investment was 10.7202 million yuan, 28.265 million yuan and 49.1663 million yuan, accounting for 27.81%, 7.73% and 6.57% of the operating income of the year, respectively; the cumulative investment in research and development in the past three years was 88.1515 million yuan, accounting for 7.65% of the cumulative operating income in the past three years.
Yong silicon electronics attaches great importance to R & D investment, forming outstanding R & D results. As of May 15, 2021, the company has obtained a total of 55 authorized invention patents, of which 39 are patents that have formed the main business income. The issuer has now formed high-density fine-pitch bump flip-up technology, high-density module (SiP) packaging technology, high-power high-heat dissipation chip packaging technology and other characteristic processes, especially in the field of RF, especially in the RF PA, FEM module product packaging technology capabilities have reached a high level.
Raised 1.5 billion yuan, committed to becoming the most competitive high-end packaging and testing enterprise in the industry
According to the prospectus, Yongsi Electronics intends to publicly issue no more than 60 million A shares, and the raised funds will be invested in the "high-density SiP RF module packaging and testing project" and the "integrated circuit advanced packaging wafer bump industrialization project" after deducting the issuance fee, as follows:
Yongsi Electronics said that the raised funds intend to invest in the "high-density SiP RF module packaging and testing project" and "integrated circuit advanced packaging wafer bump industrialization project", the two investment projects are around the company's main business, is the company's existing business extension and upgrade.
"High-density SiP RF Module Packaging and Testing Project" intends to build the production auxiliary facilities required for this project in the company's existing plant, and at the same time will purchase a number of advanced system-level packaging production equipment to improve the company's high-density SiP RF module processing capabilities and expand the company's advantageous product output. After the project is fully completed, 145 million SiP RF modules will be added per month for packaging and testing capacity, and the company's system-in-package process capabilities will be further enhanced.
The construction content of the "Integrated Circuit Advanced Packaging Wafer Bump Industrialization Project" is to renovate the clean room in the existing plant and introduce a full set of wafer "Bumping Process" production lines. Through independent research and development, the company has the technical reserves to implement the wafer "bump process". Through the implementation of this fundraising project, the company can industrialize the technical reserves, make up for the shortcomings in the current process process, effectively reduce production costs, and further improve the company's profitability.
Through the implementation of this project, on the one hand, the company can improve the process of flip-packed packaging products and make up for the shortcomings of the company's production process; on the other hand, it can provide process support for fan-out, WLCSP and other advanced packaging products to be developed. Through the implementation of the above two fund-raising investment projects, the company can realize the expansion of advantageous products and the upgrading of existing process technology, lay a solid foundation for the company to expand its product line and enrich product types in the field of advanced packaging, and further improve the company's core competitiveness.
Yongsi Electronics pointed out that in the future, the company will always adhere to the core values of "commitment to integrity, fairness and openness, and focus on cooperation", take the market as the guide, take the technology as the support, take honesty and trustworthiness as the fundamental principle, continuously improve the technical strength, and provide customers with the most optimized semiconductor packaging and testing technology solutions. On the one hand, the company will further expand the advanced packaging capacity under the premise of ensuring the quality of packaging and testing services, and improve the company's ability to serve customers. On the other hand, the company will extend its strategic development direction to the field of wafer-level packaging, and continue to enrich the company's packaging product types, promote the steady improvement of the company's main business income, and enhance the company's technical competitive advantage and sustained profitability by implementing the wafer bump industrialization project layout "Fan-in", "Fan-out" (Fan-out), 2.5D, 3D and other wafer-level and system-level packaging application fields.
Yongsi Electronics stressed that the company will continue to carry forward the "pursuit of excellence, create perfection" spirit of enterprise, adhering to the "people-oriented, continuous management" talent strategy, adhere to the "independent innovation, excellence" research and development policy, for the company to become "the industry's most competitive high-end IC packaging & testing enterprises" and efforts. (Proofreading | Arden）