On April 28, 2022, the third-party professional scientific and technological achievement evaluation agency, Zhongke Hechuang (Beijing) Scientific and Technological Achievements Evaluation Center, in accordance with the relevant provisions of the Ministry of Science and Technology's "Science and Technology Evaluation Measures", in accordance with the standards and procedures for the evaluation of scientific and technological achievements, in line with the principles of science, independence, objectivity and impartiality, organized experts to evaluate the scientific and technological achievements of the "12-inch high-precision automatic wafer scribe" project completed by Shenyang Heyan Technology Co., Ltd.
The expert committee for the evaluation of achievements was composed of experts such as Tang Zhen'an, professor of Dalian University of Technology, Wang Dazhi, professor and director of Northeastern University, Zhao Jibin, researcher and director of Shenyang Institute of Automation, Chinese Academy of Sciences, Sun Xingwei, professor and vice dean of Shenyang University of Technology, and Jiang Lijuan, researcher and director of the 47th Research Institute of China Electronics Technology Group Corporation.
After expert review, it is believed that the project successfully developed a 12-inch automatic wafer scriber. The main innovation points are as follows: the queue triangle reinforcement frame gantry support structure is designed, which improves the stability of the dicing process, effectively reduces the impact of the spindle and blade rotation vibration on the cutting effect during the processing process, proposes a heuristic intelligent path algorithm, develops a multi-axis linkage high-precision positioning control system, realizes the dicing path planning and dynamic adjustment, and develops the software and hardware technology for identifying the edge of the knife mark, and improves the positioning speed of the scriber. The project has applied for 23 invention patents, including 5 authorized invention patents, 7 authorized utility model patents, and 11 registered software copyrights. The project products have been verified by Huatian Technology Co., Ltd., with stable performance, meeting the requirements of the integrated circuit packaging process slicing process, realizing import substitution, and having good economic and social benefits. The overall technology of this achievement has reached the international advanced level, and it has filled the domestic gap in the dual shaft cutting and alignment technology. After comprehensive review by the expert group, the participating experts unanimously agreed that the "12-inch high-precision automatic wafer scribe" project passed the evaluation of scientific and technological achievements.
