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【News】TSMC: 8-inch wafer to increase the price; Redmi K50 series official announcement...

TSMC: 8-inch wafers to increase the price

According to the Electronic Times, some IC designers said that TSMC plans to raise the OEM quotation of 8 inches of mature process in the third quarter, and the 12-inch mature and advanced process is still under evaluation.

However, the news in the industrial chain shows that although TSMC plans to increase the price of 8-inch wafer foundry services, it will not take effect immediately, and the new price is expected to be implemented in the third quarter.

【News】TSMC: 8-inch wafer to increase the price; Redmi K50 series official announcement...

Due to the impact of supply chain and other issues, the world has been in the core, foundry chip manufacturers have announced an increase in foundry fees, semiconductor prices have always climbed.

In September last year, TSMC notified customers that the foundry price of all chips rose by up to 20%. Among them, the quotation of 7nm process technology rose by 3%-10%, and the price of mature processes above 12nm rose by 20%.

In TSMC's current revenue, 12-inch wafer foundry services account for a large proportion, and the foundry price of 12-inch wafers has been raised many times before.

Although the news in the industrial chain did not mention the news of the price increase of the 12-inch wafer foundry service, in the case of strong demand and tight production capacity, it is not excluded that TSMC will raise the subsequent increase.

Redmi K50 Series Official Announcement

March 10 news, Redmi Redmi mobile phone officially announced, K50 flagship series will be released at 19:00 on The evening of March 17, the official said that "the imagination of the Tianji annual dual flagship chip, the unimaginable hardcore all-round experience, the heroic lineup, it will be full of your heart and mind, usher in the K series positioning and then breakthrough." ”

【News】TSMC: 8-inch wafer to increase the price; Redmi K50 series official announcement...

Judging from the warm-up poster, the K50 series rear camera adopts a triangular arrangement, the main camera is a 108 million pixel lens, and the edge of the fuselage is very rounded, which should feel very good.

This afternoon, Lu Weibing, President of Xiaomi Group China and General Manager of Redmi Brand, announced that the Redmi K50 series is equipped with MediaTek Tianji 9000 flagship processors. Lu Weibing said that the MediaTek Tianji 9000 chip "debut is the peak", it meets all your expectations for performance and power consumption.

It is reported that The Tianji 8100 adopts the TSMC 5nm manufacturing process, the CPU is eight cores, including four A78s, four A55, the large core frequency reaches 2.85GHz, and the GPU is a six-core Mali-G610, which is the same as the top flagship Tianji 9000, a core top of the past two, the performance is comparable to the Snapdragon 888.

More importantly, in the actual measurements of MediaTek's official and some bloggers, the Performance of Tianji 8100 is comparable to that of Snapdragon 888, and it only has the power consumption of Snapdragon 870, which is worth looking forward to.

According to previous news, the Redmi K50 series has three models: Redmi K50, Redmi K50 Pro, and Redmi K50 Pro+, which are equipped with Snapdragon 870, Tianji 8100, and Tianji 9000 chips.

Intel will host vision 2022 conferences on May 10

Recently, Intel announced that it will host a two-day Vision 2022 conference on May 10, which will include multiple keynotes and business presentations. Vision 2022 is part of the Intel ON series that began last year and requires registration to watch online or attend a conference.

【News】TSMC: 8-inch wafer to increase the price; Redmi K50 series official announcement...

Intel confirmed that their Vision 2022 event will include product and partner solution content, business insights, breakout sessions and business workshops, ecosystem technology demonstrations and experiences, and attendees will have the opportunity to participate in discussions, with more than 100 presentations, product demonstrations, technology experiences, and expert-led business workshops.

The conference schedule is May 10 to 11, interestingly rumored that intel Arc Alchemist graphics cards will be released on May 10, but the likelihood of launching consumer products at such an important conference that requires registration to participate is extremely low, and it is estimated to be another event.

Realme GT Neo3 was officially announced in March

Entering March, the mobile phone circle is also gradually lively, realme announced today, realme GT Neo3 will be officially released this month, known as "super 100 watts dual core, flagship liter cup!" Push the boundaries of speed! ”

【News】TSMC: 8-inch wafer to increase the price; Redmi K50 series official announcement...

It is worth mentioning that in addition to the first batch of Tianji 8100, realme GT Neo3 will also launch the world's first 150W light speed second charging technology, which can be charged to 50% of the power in only 5 minutes, which is also the fastest charging speed mobile phone at present.

According to previous revelations, the realme GT Neo3 flash version provides a 4500mAh capacity battery + 150W flash charge, and the standard version provides a 5000mAh battery + 80W flash charge.

【News】TSMC: 8-inch wafer to increase the price; Redmi K50 series official announcement...

Officials said that the realme 150W light speed second charging technology uses parallel multiple charge pumps to increase the charging current, with lower conversion loss, lower resistance, lower temperature to achieve 150W high-power flash charging. The new fast charging architecture uses a new temperature control management mechanism, which can keep the operating temperature below 43°C at all times.

Judging from the exposed renderings, realme GT Neo3 uses a mid-mounted cut-out screen and the back is designed for a family matrix camera, and Xu Qi, vice president of realme, said in his interaction with netizens that the industrial design of realme GT Neo3 is amazing.

ASUS released a new generation of mini PC hosts

On March 10, ASUS launched a new generation of mini PC host PN63-S1, equipped with a 35-watt Intel Core i7-11370H processor, supporting up to three 4K displays. Its three dimensions are only 13 cm x 12 cm x 6 cm, weigh about 900 grams, can be hung directly behind the screen, and will not appear too heavy.

【News】TSMC: 8-inch wafer to increase the price; Redmi K50 series official announcement...

The ASUS PN63-S1 offers multiple processor options: Intel Core i3-1115G4, Intel Core i5-1135G7, Intel Core i7-1165G7, Intel Core i5-11300H, Intel Core i7-11370H.

The ASUS PN63-S1 has three hard drive slots, in addition to the 2.5-inch bay for 7mm SATA III HDDs or SSDs, and two M.2 2280 slots for solid-state drives. One is PCIe Gen 4 x4 and the other is PCI Gen 3 x4.

The ASUS PN63-S1 has two memory slots that can accommodate up to 64GB of DDR4-3200 memory (32GB per slot) and supports up to WiFi 6E and Bluetooth 5.

Interfaces include: 1 x 2.5 Gbps Ethernet, 1 x HDMI 1.4, 1 x Mini DisplayPort 1.2, 1 x configurable (DisplayPort 1.4, COM or VGA), 1 x USB 3.2 Gen 2 Type-C, 3 x USB 3.2 Gen 2 Type-A, 1 x 3.5 mm audio, 1 x SD reader.

In terms of price, prices are expected to range from 430 euros (about 3,000 yuan) for the Core i3 model to 620 euros (about 4,300 yuan) for the version with the top Core i7-11370H processor.

Huawei's 2022 whole-house smart and all-scenario new product spring conference was confirmed

On March 10, Huawei officially announced that the 2022 Huawei Whole House Smart and All-Scenario New Product Spring Conference will be held at 19:00 on March 16, and from the warm-up poster, it may launch a ring-shaped new product, such as a ring fill light, table lamp and so on.

【News】TSMC: 8-inch wafer to increase the price; Redmi K50 series official announcement...

It is worth mentioning that shortly after Huawei's official announcement, some digital bloggers posted Huawei MatePad Paper experience videos and hands-on pictures, and said that the product will be released in China on March 16.

【News】TSMC: 8-inch wafer to increase the price; Redmi K50 series official announcement...

It is reported that Huawei MatePad Paper is equipped with a 10.3-inch E-ink screen, with a resolution of 1872×1404, a screen ratio of 86.3%, with Huawei's self-developed ink screen display enhancement algorithm, built-in reading lights, and support for 32 levels of brightness adjustment.

As for the core performance, it was learned from Huawei's overseas official website that huawei MatePad Paper is equipped with Kirin 820E processor, 7nm process process, and the chip is first used by Huawei nova 7 SE 5G LOHAS edition. However, whether Huawei's MatePad Paper Edition will use this chip is not yet known.

In addition, Huawei MatePad Paper supports the second generation of M-Pencil, with 26ms low latency and 4096 pressure sensitivity.

As the first Hongmeng ink horizontal board, Huawei MatePad Paper also supports hyperterminal, which can be interconnected with mobile phones, notebooks, etc., and can transfer the reading content on the mobile phone to the tablet with one click to continue reading, and after coordinating with the PC, the second becomes the PC's exclusive eye protection expansion screen.

In other aspects, this ink level board has a built-in 3575mAh battery, supports 25W fast charging, and has a battery life of up to 28 days, which is much longer than traditional Android tablets.

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