The recent conference is very much, and it has not been shared for a long time to share the disassembly content, today Xiao e turned over the Redmi K50 e-sports version that was disassembled before the epidemic, roughly sorted out the dismantling steps, this time let's take a look at the disassembly of the Redmi K50 e-sports version!
As an e-sports version of the mobile phone, it needs stable performance and strong battery life, which we can feel in the configuration parameters. In addition, the most important thing is the ability to dissipate heat, even in the face of Qualcomm Snapdragon 8Gen1 processor also need to be prepared for heat dissipation.
After disassembling the phone, eWisetech engineers evaluated the heat dissipation ability of Redmi K50 in this way: the whole machine has made sufficient preparations in terms of heat dissipation, using graphene heat dissipation film, copper foil, copper plate, stainless steel VC liquid cold plate, VC liquid cold copper plate and thermal grease and other heat dissipation materials, respectively, covered in various hot-prone positions, and the heat dissipation effect can be imagined.
Details found in the dismantling project
The disassembly method is the same, first remove the catto, the catto supports dual Nano-SIM cards, with front and back logos, with silicone ring dust and water resistance. After heating the back cover, remove it. The glass back cover is pasted with cushioned foam, and the inside of the phone adopts a three-stage structure, and the battery is covered with a large area of graphite patches. The gaming version is equipped with a dual LED flash, and the connection between the flash soft board and the motherboard has a protective cover and is screwed. Anti-tampering labels are attached to the internal fixing screws.
Then remove the screws and remove the rear camera cover, motherboard cover, and speaker module. The rear camera cover is covered with cushioned foam. The flash pad is fixed with double-sided tape and a color temperature distance sensor is integrated on it, which is protected by a rubber sleeve. LDS antenna technology is integrated on the protective cover of the motherboard, and underneath is a rubber-fixed NFC coil and graphite sheet. The inside is covered with copper plates and several cushioning foams.
The motherboard shield is covered with graphite patches to dissipate heat, and the overhead speakers are between the front and rear cameras. The integrated speakers at the bottom are designed as dual speaker units and supplied by AAC AAC Technologies.
The K50 gaming edition uses a dual-cell, three-interface lithium-polymer battery with glue-fixed and plastic easy-to-detach handles on both sides. Battery model BP48, produced by Dongguan New Energy, has a rated capacity of 2280 mAh for a single cell.
Disconnect the various connectors and remove the main and secondary boards, FPC flex boards, connection cables, and antenna boards. Not only is the front of the motherboard equipped with a shielding cover and heat dissipation copper foil, but also the front of the secondary board. The Type-C connector on the bottom of the subplane is equipped with a dust-proof silicone ring. The support in the middle frame is attached to the contact surface with the motherboard with a small piece of thermally conductive copper, and the surface is also coated with thermal grease. There is also a small amount of heat dissipation grease in the bottom subplane mounting slot position.
Immediately after removing the other widgets on the middle frame, including the side keys, shoulder keys, speakers, earpiece, FPC flex board, and X-axis linear motor. Among them, the linear motor, speaker and earpiece assembly are fixed by glue, the top tweeter is produced and supplied by Goertek, and the motor is the first AAC AAC AAC Technology CyberEngine ultra-wideband X-axis motor.
K50 gaming version of the side button using a positioner and screw fixing, in the right side of the phone with independent pop-up shoulder key and shoulder key switch, the button is made of metal material, a total of 16 magnets adsorbed on the back, and the button locator in the 12 magnets to form an open and close structure.
The K50 Gaming Edition uses a 6.67-inch OLED flexible straight-faced screen, which is fixed with foam glue, a 1-circle plastic border between the middle frame, and a speaker dust screen and a positioning frame at the bottom of the screen. There is heat dissipation copper foil on the back of the screen, graphite sticker on the bottom, and large black graphite sticker on the front of the middle frame.
Under the graphite paste are two VC liquid-cooled copper plates and a thermally conductive copper plate. Assists the motherboard SOC, battery, and bottom components to dissipate heat, respectively. Finally, remove the side volume button softboard, which integrates a pickup microphone.
Summary: Redmi K50 e-sports edition is relatively simple to disassemble, the common three-stage stacking structure, the fixing method is mainly to use screws + adhesive to fix components. Without destroying internal components, it is somewhat reducible. It does a good job of heat dissipation.
Dual VC liquid cold plate is used, 1 large area stainless steel liquid cold plate + 1 double VC liquid cold copper plate is located in the center and bottom position of the support plate in the middle frame, and the surface is covered with graphene heat dissipation film; the SOC main control chip is also equipped with independent copper plate heat dissipation. Heat dissipation copper foil or graphite heat dissipation film is applied to the battery, the shield cover of the motherboard and the side of the motherboard cover. The inside of the motherboard cover is covered with thermal copper foil, and even on the inside of the rear cover there is graphite material to assist the K50 top speaker unit to dissipate heat. It can be said that it is all-encompassing.
Finally take a look at the IC on the motherboard:
Motherboard front primary IC:
Samsung-K3LK7K70BM-BGCP-8GB LPDDR5 RAM
2. Qualcomm-SM8450-Qualcomm Snapdragon 8Gen1 octa-core processor
Samsung-KLUDG4UHGC-B0E1-128GB flash memory
4. Qualcomm- WCN6856- Wi-Fi 6/6E + Bluetooth
Qualcomm- PM8350BHS- Power Management Chip
6. Qualcomm-QET7100- 100MHz Network Envelope Chip
7. NXP-SN100T-NFC control chip
8. Cirrus Logic- CS35L41B- Audio Chip
9. InvenSense-ICM-42607- Accelerometer and Gyroscope
Qualcomm-SMB1399-Charging Chip
The main IC on the back of the motherboard:
1. Qualcomm-PM8350C - Power Management Chip
2. Skyworks- SKY58080-11-RF RF front-end chip
3. QORVO-QM77048E-RF FRONT-END MODULE
4. Qualcomm- SDR735- RF Transceiver
5. Skyworks- SKY53730-11- Diversity Receive Module
In fact, the K50 e-sports version of the 120W fast charge is also a major feature, which is not only the dual cell 3 interface lithium polymer battery seen in the disassembly, but also qualcomm's new fast charging scheme can be seen on the main and secondary boards, which is composed of 1 SMB1399 and 2 SMB1396 fast charge pump chips. The performance of the new charging scheme is significantly improved compared with the previous generation platform, and the charging efficiency is increased by 70%.
Today's disassembly ends here, for the details of the Redmi K50 esports edition can be viewed in the search library, and the search library can also be consulted to view the equipment disassembled forward. Because of the epidemic, we can't disassemble the latest equipment at the first time, but after the epidemic stabilizes, we will continue to disassemble, gradually purchase and disassemble popular equipment, and small partners want to know which equipment, you can also leave a message!
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