Tongxingda: Subsidiary Kunshan Tongxingda signed a major contract with Kunshan Riyueguang

Jiwei Network news, on January 5, Tongxingda issued a progress announcement on the signing of major contracts. Tongxingda said that recently, the company's subsidiary Kunshan Tongxingda Chip Packaging and Testing Technology Co., Ltd. (hereinafter referred to as "Kunshan Tongxingda") and Kunshan Riyueguang officially signed the "Packaging and Testing Project Cooperation Agreement" on the "Chip Advanced Packaging and Testing (Gold Bump) Whole Process Packaging and Testing" project cooperation.

It is understood that the main content of the contract is divided into two parts, the first part is to jointly build the "chip advanced packaging and testing (Gold Bump) full-process packaging and testing" production line, and the second part is to provide processing Gold Bumping and wafer testing services (hereinafter referred to as "this service") for the specific integrated circuits commissioned by Kunshan Tongxingda.

According to the content of the announcement, in the joint construction of the "chip advanced packaging and testing (Gold Bump) full-process packaging and testing" production line, Kunshan Tongxingda invested in the equipment required for the Gold Bumping (gold bump) section, the wafer test section test machine, and the special equipment required for the COF/COG section to the production line location, with a production capacity allocation of 20,000 pieces / month.

Kunshan Tongxingda investment outside the investment project of Kunshan Tongxingda in the Gold Bumping section + wafer test section, including but not limited to the wafer test section Prober, the production capacity configuration is 20,000 pieces /month, the operation team, production personnel, intellectual property rights/technology required for the Gold Bumping section and the wafer test section, and the provision of bump Bumping and wafer testing services to Kunshan Tongxingda, as well as other matters of the agreement.

Tongxingda said that the company is mainly engaged in liquid crystal display modules and optical camera modules, and the raw materials include display driver ICs and CIS chips. The packaging and testing project can strengthen the connection with upstream chip companies, ensure the chip supply of display and optical camera module business to a certain extent, and reduce some procurement costs and enhance the company's profitability.

At the same time, it also bluntly said that the advanced packaging gold bump production process involves UBM coating and lithography and other difficult processes, not only need to purchase supporting equipment according to the characteristics of the product process, and need to be debugged and trial production by a professional team, in this process, specific equipment needs to continue to run and invest, if there is no professional and reliable technical team, the early stage will consume a lot of time and resources. Kunshan Riyueguang Semiconductor has rich and mature technology and project experience, and kunshan Riyueguang Semiconductor is selected for this project to be responsible for technical and personnel matters, which can ensure rapid mass production and stable product yield to the greatest extent. (Proofreading/New)