TSMC will build a new packaging plant to cope with the surge in chip demand

According to the Electronic Times, TSMC (TSM.N) is planning to build a new advanced packaging plant in Chiayi or Yunlin in southern Taiwan to cope with the rapid growth of 5/3/2nm chip manufacturing demand, and quickly revise its production roadmap, and the current Taiwan Chiayi is more likely. TSMC did not comment on the report. If the news is true, this will be TSMC's sixth advanced packaging plant, Zhuke, Nanke, Zhongke and Longtan have a total of four, mainly providing wafer bumps, advanced testing and back-end 3D packaging, etc., the fifth is Miaoli Zhunan under construction, the former 3D packaging and chip stacking and other advanced technologies are the mainstay, with a total area of 1.3 times the total area of the first four sealing and testing plants, and mass production is expected to begin in the second half of 2022.