In the Year of the Tiger, the spring blossoms, and the severe epidemic situation spreads throughout Kyushu. The global lack of core is still there, and the semi-pilot track is competitive. At present, the world lacks cores, and many semiconductor companies are trying their best to seize the dividends of the times and achieve overtaking in semiconductors as much as possible. However, as we all know.
At present, the advanced process of chips has been carried out to 3 nanometer chips, it can be said that in the future, there is not much room for development in advanced processes. Therefore, more and more companies are focusing on advanced packaging. Recently, new 3D package chips have emerged, and a new high-end chip in 7nm 3D package has been launched. This is the world's first high-end 3D package chip.
So, if this very advanced 3D packaging technology is mastered by the mainland, what kind of impact will it have on China's core industry? Nowadays, with the emergence of such advanced 3D packaging technology, is there any hope to break through the limits of Moore's Law and achieve a breakthrough in the semiconductor field?
The world's first 3D package chip was born!
On March 3, Graphcore, a UK-based AI company, released a new generation of IPU products, Bow, which is already the company's third-generation IPU chip, the new, the world's first 3D packaging chip compared to the company's previous generation. 40% improvement in performance and 16% improvement in energy consumption ratio and power efficiency.
Through such data, it is not difficult to see that the strength of the world's first 3D package chip is still relatively strong, of course, the biggest highlight of this chip is that this is a chip that does not increase the price, and the price is said to be similar to the previous generation. Of course, why this chip is so strong, in fact, is because TSMC used advanced 3D WoW silicon wafer stacking technology when it oem this chip.
This 3D silicon wafer stacking technology is mainly to use related stacking technology or other micromachining technology to stack chips from bottom to top, thereby forming a 3D stack. The effect of such stacking technology, the British AI company Graphcore has proved that indeed, the improvement of chip performance is not only the advanced process of the chip, but also from the packaging process.
At present, the mainland continent has not yet mastered this technology, so once the mainland continent can master such advanced packaging technology, what benefits will it bring to the development of China's core industry?
What are the benefits of mastering 3D packaging technology for China's core business?
As we all know, in the development of China's core, there is a certain degree of problem in the mainland, that is, the United States modified the rules, and Asmer's EUV lithography machine could not achieve free shipments to the mainland. In this way, the mainland can only produce some low-end domestic cores. And how to compete with those high-end chips in the international community?
Today, if the mainland can master such an advanced 3D packaging process, then even if it can only produce low-end chips. Undoubtedly, it can also enhance the performance of these chips themselves, and undoubtedly enhance the market competitiveness of China's core, which is also of great help to the economic interests and market impact of the mainland.
In addition, if the mainland can really master this advanced packaging technology, then, China's core has undoubtedly taken a big step towards achieving independence and autonomy, which can reduce external dependence and reduce the threat of being stuck in the neck. For the mainland in the huge demand for chips at the moment, to achieve self-sufficiency, to achieve scientific and technological development, it is not necessarily impossible.
Nowadays, the development of chips has undoubtedly entered Moore's Law, so is the birth of such an advanced packaging process today, is there any hope to help the world break through the limits of Moore's Law?
Can you push the limits of Moore's Law?
In fact, with the emergence of such an advanced 3D packaging process today, it is impossible to break through the limits of Moore's Law, but it is still possible to break through the limits of moore's law at present. At present, in the advanced process of chips, there have been 3 nanometers, such a chip process is already very advanced, although there is room for development, but we can all see that there is not much.
However, the current packaging process is still 7 nanometers, although the development space is indeed not large, but compared to the chip advanced process, the development space will indeed be relatively large. Therefore, by switching to the packaging process, it is still possible to break through the limits of Moore's Law.
In addition, there are many companies with strong scientific and technological strength in the world, such as TSMC, such as Intel, there are so many strong enterprises, the future may not be able to continue to work advanced packaging technology, may not be able to break through more high-end, more advanced packaging technology. Therefore, it is not impossible for the world to break through the limits of Moore's Law when it has direction and ability.
summary
The world's first 3D packaging chip was born, and the birth of this chip is equivalent to pointing out the future direction for the development of global chips to break through the limits of Moore's Law. At present, this advanced packaging process is actually only mastered by TSMC, or hope that more and more domestic enterprises in the mainland can master this advanced technology in the future, in order to promote the development and rise of China's core.
Of course, I believe that mainland enterprises will be able to make progress in advanced packaging technology in the future, promote the development of mainland chips, and strive for the future days, mainland chips can have a great breakthrough, Chinese chips can be worthy of the signboard of Chinese manufacturing, and hope that in the future. China Core can show its own shining light in the international market and on a global scale.