The dynamic map is changdian technology The static map is CCTV science popularization
The birth of a chip,
Wafer fabrication and chip manufacturing are two major stages.
So, how exactly is the chip packaged?
Wire bond package.
With the gradual failure of Moore's Law, chip performance improvement has fallen into an unprecedented dilemma, and the emergence of system-in-packages is likely to be the winner and loser of breaking this shackle.
Chip, with the richest reserves and cheapest cost of silica as raw material, has achieved the top of science and technology on this planet, and awarded a best counterattack award, which is deserved!
So, what stage is China's "core" at present? What are the problems?
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