China's first advanced encapsulated lithography machine delivered!

Shanghai Microelectronics' first 2.5D/3D advanced encapsulated lithography machine was officially delivered to customers

On February 7, Shanghai Microelectronics held the first 2.5D/3D advanced packaging lithography machine delivery ceremony, which marked the official delivery of China's first 2.5D/3D advanced packaging lithography machine to customers.

Advanced encapsulated lithography machine released by SMEE (Source: official website)

According to China Securities Network reported on February 7, 2021, on September 18, 2021, Shanghai Microelectronics held a new product conference, announced the launch of a new generation of large field of view high-resolution advanced packaging lithography machine. Shanghai Microelectronics has said that at that time, it had reached a sales agreement with a number of customers for a new generation of advanced encapsulation lithography machines, and the first one would be delivered within the year.

Advanced encapsulated lithography machine is the current main product of Shanghai Microelectronics, and its global market share has ranked first for many years. The products shipped this time are a new generation of advanced packaging lithography machines, mainly used in high-end data center high-performance computing (HPC) and high-end AI chips and other high-density heterogeneous integration fields, which can meet the needs of 2.5D/3D super large chip size pre-package applications, representing the highest level of similar products in the industry.

Previously, Shanghai Microelectronics held a new product launch conference and announced the launch of a new generation of large field of view high-resolution advanced encapsulated lithography machine. It is reported that the new lithography machine launched at the press conference is mainly used in the field of high-density heterogeneous integration, with high resolution, high engraving accuracy and super exposure field of view and other characteristics, can help wafer-level advanced packaging enterprises to achieve the application of multi-chip high-density interconnect packaging technology, to meet the application needs of heterogeneous integration of super large chip packaging size, while helping packaging and testing manufacturers to improve the level of process, develop new processes, in the field of packaging and testing to jointly make more contributions to the development of China's integrated circuit industry. (CCTV reporter Dou Junyun Zhang Junhe)