On February 7, Shanghai Microelectronics Equipment (Group) Co., Ltd. (SMEE) held the first 2.5D/3D advanced packaging lithography machine delivery ceremony, and officially delivered the advanced packaging lithography machine to customers.
According to the official website of Shanghai Microelectronics, on September 18, 2021, the company held a new product launch conference and announced the launch of a new generation of high-resolution advanced encapsulated lithography machines with large field of view. According to Shanghai Microelectronics, the new lithography machine launched this time is mainly used in the field of high-density heterogeneous integration, with high resolution, high engraving accuracy and super exposure field of view, which can help wafer-level advanced packaging enterprises to achieve the application of multi-chip high-density interconnect packaging technology and meet the application needs of heterogeneous integration of ultra-large chip packaging size. At the same time, it will help packaging and testing manufacturers to improve the level of process, develop new processes, and jointly make more contributions to the development of China's integrated circuit industry in the field of packaging and testing.
Advanced encapsulated lithography machine released by SMEE (Source: official website)
