Zhongguancun Online News: According to CINNO, on February 7, 2022, Shanghai Microelectronics held the delivery ceremony of China's first 2.5D/3D advanced encapsulated lithography machine.
It is understood that the advanced packaging lithography machine products are a new generation of advanced packaging lithography machines, mainly used in high-end data center high-performance computing (HPC) and high-end AI chips and other high-density heterogeneous integration fields, which can meet the needs of 2.5D/3D super large chip size first package applications, representing the highest level of similar products in the industry. It is reported that the advanced packaging lithography machine is the current main product of Shanghai Microelectronics, and its global market share has ranked first for many years.
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