Recently, a research institute released a market report on global wafer capacity, according to which the monthly production capacity of global IC wafers by 2021 is 21.6 million wafers with 200 mm equivalent.
Among them, the monthly production capacity of Chinese mainland is 3.5 million pieces, accounting for 16% of the global production capacity.
Specifically, the capacity share of Chinese mainland has increased by one percentage point per year in the past two years and by 7 percentage points since 2011, when Chinese mainland accounted for 9% of total IC wafer capacity.
In addition, about half of the wafers produced Chinese mainland are produced by companies overseas and in Taiwan. Some of the largest fabs in its home territory are owned by SK Hynix, Samsung, TSMC and UMC.
SK Hynix accounts for 17% of China's production capacity. That's not counting intel's Dalian NAND flash memory plant that SK Hynix is acquiring. Ownership of the plant passed to SK Hynix in December 2021, but Intel will continue to operate until March 2025.
The agency also expects China's share of global IC wafer capacity to reach nearly 19 percent by 2024. In addition, at the end of 2021, South Korea is 23%, Taiwan is 21%, Japan is 15%, America is 11%, and Europe is 5%.
From the perspective of market share, although china's wafer market has made rapid progress, it still needs to continue to work hard in absolute terms.
(7866644)
![SK Hynix's acquisition of Intel's flash memory business is progressing smoothly AMD's acquisition of Xilinx is not yet available[fig]](data:image/gif;base64,R0lGODlhAQABAIAAAP///wAAACwAAAAAAQABAAACAkQBADs=)