Tongfu Microelectronics: It is expected that the scale of domestic customer orders will continue to increase in the future

Jiwei network news, recently, Tongfu Microelectric said in an institutional survey that the company has successively laid out in Nantong Sutong Science and Technology Industrial Park, Anhui Hefei, Xiamen Haicang layout, built a new Sutong factory, Hefei factory, and participated in the Xiamen factory, acquired 85% of the equity of AMD Suzhou and AMD Penang, and the company's main production base expanded from the previous Nantong Chongchuan headquarters to chongchuan, Sutong, Hefei, Suzhou, Malaysia Penang five production bases, and through the form of equity layout in Xiamen, forming a multi-point blossoming situation. The capacity has been doubled, especially the advanced packaging capacity has been greatly increased, and the scale advantage has been more obvious.

Tongfu Microelectronics said that the semiconductor industry has the characteristics of long introduction cycle and high entry threshold, after forming cooperation through customer verification, business stability is strong and customer stickiness is large, Tongfu Microelectric has high-quality global customer resources after years of accumulation. At present, more than 50% of the world's top 20 semiconductor companies and the vast majority of well-known domestic integrated circuit design companies have become customers of Tongfu Microelectric.

At the same time, the industry is aware of the importance and urgency of the independent and controllable integrated circuit industry chain, which has also greatly accelerated the process of localization of the integrated circuit industry. The company cooperated closely with well-known domestic semiconductor companies, and the proportion of domestic revenue in China's revenue in the first half of 2021 was 28.74%, an increase of 8.25 percentage points compared with the first half of 2020; the main reason for the above change was that the growth rate of customer orders in China was faster than the growth rate of orders from customers outside China. In this context, it is expected that the scale of domestic customer orders will continue to increase in the future.

It is reported that the company is one of the world's most extensive product coverage, the most comprehensive technology of packaging and testing leading enterprises. The company's layout of memory chips, analog chips, automotive electronics, power ICs, high-performance computing, 5G, MCUs and display drivers and other services, the downstream market space is huge, forming the company's unique differentiated competitive advantage.

In terms of technology, the company with years of technology accumulation and continuous research and development investment, has a large-scale production capacity of Chiplet packaging; in the CPU, GPU, server field based on 7nm, advanced 5nm, has now realized the process capability and certification of 5nm products, the future will help CPU customers high-end advancement; the company's advanced packaging project won the "First Prize of National Science and Technology Progress", the project broke through the bottleneck constraints of high-density and high-reliability electronic packaging technology. It has played a supporting and leading role in the high-end development of advanced packaging technology for integrated circuits in mainland China.

Looking forward to the future, with the continuous outbreak of innovative applications such as automotive electronics, 5G, cloud computing, Internet of Things, and artificial intelligence, the semiconductor industry is expected to enter a high boom cycle, and the company's future performance growth momentum is strong, which is expected to bring investors rich investment returns. (Proofreading/Arden)