IT Home January 31 news, in January this year, Huahai Zero2IPO 12-inch chemical mechanical polishing (CMP) equipment successfully shipped, into the advanced packaging international head enterprise, do TSV chemical mechanical polishing. This is a further expansion of Huahai Zero2IPO CMP equipment in the important field of advanced packaging after logic chips, memory chips, large silicon wafers, and compound semiconductors.
TSV technology (i.e. silicon through-hole technology) is a high-density packaging technology that is gradually replacing the current more mature lead bonding technology, and is considered to be the fourth generation of packaging technology. TSV technology realizes the vertical electrical interconnection of silicon through holes by filling with conductive substances such as copper, tungsten, and polycrystalline silicon. TSV package has the advantages of better electrical interconnect performance, wider bandwidth, higher interconnect density, lower power consumption, smaller size, lighter quality, etc., and greatly improves the chip speed and reduces the chip power consumption, which has become a new technology with rapid development in electronic packaging technology.
Integrated circuit equipment company Huahai Zero2IPO CMP products have been used in batches in many advanced integrated circuit manufacturing enterprises at home and abroad, after the company's 12-inch ultra-precision wafer thinning machine entered the advanced packaging production line.
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