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Dinglong shares: cleaning liquid and other core process materials have been mass production in the first phase, is undergoing client test verification

Dinglong shares: cleaning liquid and other core process materials have been mass production in the first phase, is undergoing client test verification

Jiwei Network news, on December 17, Dinglong shares on the investor interactive platform on the previous investor "in addition to the CMP polishing pad has been successfully mass production, the rest of the materials such as cleaning liquid, trimming plate, polishing liquid nano-grinding particles when can be mass production?" The inquiry response said that the company's CMP global flattening polishing pad other core process materials have been mass-produced in the first phase, and the client test verification of mass production line products is underway. The company's current main products in the field of semiconductor materials include: CMP global flattening materials, flexible panel import substitution materials, and advanced packaging materials research and development, different new products at different stages of progress.

According to the data, the main business of Dinglong Co., Ltd. is the optoelectronic semiconductor process materials industry and the printing and copying general consumables industry. The main products are CMP polishing pad, flexible display substrate material PI slurry, cleaning fluid, color polymerized toner, general consumable chip, development roller, compatible consumables, ink cartridges, etc. Dinglong CMP polishing pad products have successfully entered the domestic mainstream fabs, the market promotion of yellow PI paste has been carried out smoothly, and the verification and production capacity construction of cleaning liquid products have been promoted as planned. In addition, Dinglong co., Ltd. is also developing other high-tech threshold import substitution materials such as photosensitive polyimide PSPI and panel packaging materials INK, and continues to expand the product layout of the optoelectronic semiconductor materials sector.

In the field of semiconductor display materials, Dinglong shares benchmark foreign leading panel material enterprises, layout a variety of technical difficulties of card neck display materials, of which: flexible display panel substrate YPI paste is currently the most mature material, has entered the batch release stage; OLED display with photosensitive polyimide PSPI, panel packaging material INK in the client verification, test feedback in line with expectations; OLED touch protection layer low temperature OC and other display materials research and development as scheduled.

In addition, Dinglong shares also actively expand overseas markets, on December 1, after rigorous verification in the client, Dinghui Microelectronic Materials Co., Ltd. for W process 12-inch CMP polishing pad products passed the verification at one time, completely dispelled the doubts of a technical expert of an international semiconductor giant, and the two sides officially opened the road of cooperation. (Proofreading/Andy)

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