Jiwei network news, recently, Changchun Erdao District and Jilin Province Tongxin Integrated Circuit Material Co., Ltd. signed a contract to dock the third-generation semiconductor industrial park project, and join hands to build the largest third-generation compound semiconductor material production base in China.
Image source: Erdao District Government of Changchun City
It is reported that the third-generation semiconductor industrial park project focuses on Jilin Province's automobile chip supporting, new energy vehicle charging facilities supporting, land wind and solar Three Gorges supporting and other fields, after the production will be built annual output of 25,000 six-inch silicon carbide crystal ingots and related extended chain products production line, for the automobile, rail bus, optical equipment and other industrial products to lay the foundation. (Proofreading/Small)
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