In the era of electric vehicles, The whole line of Price Bond Power Semiconductor Packaging has been listed on the market

Jiwei Network reported that power devices and third-generation semiconductors are the hot spots of the current semiconductor industry technology chase, and they are also one of the most promising areas in the domestic semiconductor industry to catch up with and surpass the world's advanced technologies.

At present, many domestic power semiconductor manufacturers have successfully broken through in various aspects of materials, design, manufacturing, packaging and testing, and gradually formed a complete industrial chain that is independent and controllable. However, in the field of high-end packaging equipment in the upstream of the industry, it is still dominated by foreign companies, so it is urgent to accelerate the localization of high-end packaging equipment for power semiconductors.

With the advent of the power semiconductor era, clip Bond packaging has a lot of potential

Compared with digital integrated circuits, power semiconductors are not simply the pursuit of line width reduction, and long life cycle, large market space, can be applied to almost all electronic manufacturing industries, including industrial control, communications, consumer electronics, new energy, automotive, rail transit, smart grid, etc.

It is foreseeable that with the outbreak of demand for intelligent driving, intelligent manufacturing, and new infrastructure, the global power semiconductor market will continue to grow in the next 5 years. According to Omdia data, the global power semiconductor market is expected to grow to $44.1 billion in 2021 and exceed $50 billion by 2024. Among them, the size of China's power semiconductor market will reach 15.9 billion US dollars in 2021 and is expected to reach 19 billion US dollars by 2024.

As the world's largest consumer of power semiconductors, after years of independent research and development and the introduction and absorption of foreign technologies, the process capabilities in the field of domestic power semiconductors have continuously broken through, and have certain competitiveness in the fields of power diodes, transistors, thyristors, medium and low voltage MOSFETs, power management ICs and other fields.

At the same time, in order to improve the yield and reliability of discrete devices, discrete device packaging and testing companies are developing more advanced packaging processes and packaging technologies for new products.

Under the impetus of the demand of large current, high voltage and other application scenarios, the new discrete device packaging process represented by Clip Bond has risen rapidly, which has the advantages of improving current carrying capacity, improving device board-level reliability, effectively reducing device thermal resistance, and improving packaging efficiency, etc., and has become the main packaging process technology mastered by domestic mainstream power device manufacturers such as China Resources Micro, and has been widely used in industrial control, new energy vehicles and other fields.

In addition, the development of emerging fields such as 5G networks and the Internet of Things has also put forward new requirements for power semiconductor packaging technology, and miniaturization, functional systematization, and modular packaging have become the main directions of the current development of power semiconductor packaging technology.

Obviously, in order to improve power density and optimize power conversion, the power semiconductor packaging process needs to achieve technological breakthroughs at both the device and module levels, thereby improving product performance and service life.

In line with the trend, the complete Clip Bond process packaging equipment product line was launched

It is worth noting that as a new type of power semiconductor packaging process, Clip Bond and modular packaging have broad application prospects, including China Resources Micro, Silan Micro, Huawei, BYD, CRRC Times and other domestic mainstream power device manufacturers are carrying out large-scale expansion, but due to the surge in downstream market demand, the production capacity of upstream equipment suppliers is obviously insufficient.

Jiwei Network learned from the outstanding domestic packaging equipment supplier Prexin that under the interference of the global epidemic, the delivery time of imported equipment has been extended for half a year, or even a year, and the packaging and testing factory cannot get enough equipment.

For the semiconductor industry, the market changes very quickly, and no one can predict the subsequent market situation. Therefore, whether it can quickly obtain equipment, expand production capacity, and then seize more market share is crucial for power semiconductor manufacturers.

It is understood that for the need to use copper jumper process (Clip Bonding) of high-power semiconductor packaging production line, customers need to buy Die Bonder (solid crystal machine), Clip Bonder and vacuum furnace equipment, of which Die Bonder is the core product of the whole line equipment, technical difficulty, for a long time the market has been ASMPT, Besi and other manufacturers monopoly, with Clip Bonding process of the whole line of products manufacturers are even fewer, The overall market is basically monopolized by ASMPT, and the price of equipment is higher.

In this case, the domestic power semiconductor market urgently needs domestic packaging equipment, so that the dependence of equipment on imports has been completely improved. Based on its own Die Bonder equipment advantages and customer needs, Praxe has developed Clip Bonder equipment and vacuum furnace, becoming one of the few packaging devices in the market that can provide automotive grade Clip Bond full-line products.

Praxey Clip Bond encapsulates the entire line of devices

"The company has mature Die Bonder equipment, in terms of 8-inch equipment, the company and imported equipment accuracy and speed can be consistent, in terms of 12-inch equipment, the company can do accuracy and imported equipment consistent with the case, the work efficiency is 30% higher." In the Clip Bonder product, Plesio still maintains the characteristics of high precision and high speed, relative to international manufacturers, Plesion's Clip Bond product line using multi-point glue heads, in the same condition of ensuring the same accuracy as international manufacturers, there is a faster speed, relative to domestic manufacturers, Plession can provide higher accuracy, breaking the domestic Clip Bond products can only do low-end separation device technical embarrassment. Li Daodong, marketing manager of Praxe, said that the company's equipment delivery time is 3-4 months, which can win more time for customers and ensure the efficient advancement of the expansion progress.

Write at the end

At present, domestic semiconductor packaging equipment has gradually completed domestic substitution in some areas with low requirements, but in the new power semiconductor packaging process such as Clip Bond and third-generation semiconductor modular packaging, the overall market is still occupied by imported equipment.

With the transfer of the semiconductor industry chain to the domestic market, China Resources Micro, Silan Micro, Huawei, BYD, CRRC Times, etc. are all undergoing large-scale expansion, bringing huge development opportunities for the development of the domestic packaging equipment industry.

According to the data, the market size of the Chinese mainland's entire line of equipment products for Clip Bond is about 1 billion yuan per year, and the modular packaging equipment products are about 2 billion yuan, and this data continues to grow. Since its inception, Pride is based on the high-end market, at this time to launch a cost-effective, stable delivery of Clip Bond full line of products, and actively layout the third generation of semiconductor modular packaging equipment product line, is expected to promote the localization rate of packaging equipment significantly improved, but also to help domestic power semiconductor manufacturers accelerate the upgrade to the advanced packaging field.