Huang Shaowa, chairman of Quanxing Technology: To build a world-class storage and testing base, revenue is expected to double in 2022

Shenzhen Quanxing Technology Co., Ltd. (hereinafter referred to as "Quanxing Technology") is a high-tech enterprise integrating chip packaging, testing, product development, production and global sales. The core team has been working in the semiconductor storage industry for 25 years, with profound technical accumulation, in 2016, Quanxing Technology responded to the call of the state to vigorously develop semiconductor memory, began to lay out Chinese manufacturing, try domestic substitution, in 2021 will be distributed in Shenzhen Qianhai R & D center, Shenzhen Longhua's packaging plant, SMT plant, test plant to expand the scale of operation integration landed in Shenzhen Pingshan New District, set up a wholly-owned subsidiary Shenzhen Quantian Technology Co., Ltd., is committed to creating a world-class intelligent manufacturing base. Recently, at the "2022 3rd China Semiconductor Investment Alliance Annual Conference and China IC Awards Ceremony" jointly held by China Semiconductor Investment Alliance and Aijiwei, Quanxing Technology won the "Annual Market Breakthrough Award".

In 2021, new products such as DDR5 memory module and high-speed PSSD will be launched

At present, the impact of the continuation of the epidemic on the entire semiconductor industry still exists, and the formation of remote office, online meetings and online education habits has accelerated the digital transformation of multiple industries and promoted technological updates such as network communications, AI, storage and cloud services. Chip shortage is still not alleviated, the semiconductor industry in the expansion of production capacity at the same time, is also actively upgrading the process to improve output; Quanxing Technology Chairman Huang Shaowa said that in the face of the new and changeable development situation, Quanxing Technology still continues to increase investment in research and development and technological innovation, after unremitting efforts, Quanxing Technology developed a DDR5 storage module, high-speed external SSD PSSD, leading the development of the domestic storage industry.

Huang Shaowa further explained that with Intel's 12th-generation CPU, Quanxing Technology launched DDR5, breaking through the DDR4 performance ceiling. The Quanxing DDR5 storage module uses Micron's latest 1znm 16Gb DDR5 particles, which has a higher starting frequency than DDR4 memory, and the standard frequency is increased from DDR4 3200MHz to 4800MHz.

Huang Shaowa also revealed that at the end of this year, Quanxing Technology launched a high-speed external SSD PSD, with a speed of 2000 megabytes of read and write speed, which will become the mainstream products in the future market.

Advanced packaging technology or into the "new Moore's Law"

In the future, heterogeneous computing that can combine different processes, architectures, different instruction sets, and different functions of hardware will become one of the important ways. The linear IC technology development route and the market demand for innovative solutions have pushed packaging, especially advanced packaging technology, to the forefront of innovation.

Huang Shaowa revealed that Quantian Technology Intelligent Intelligent Manufacturing Base will gradually lay out advanced packaging technology, open up various process routes, enrich product lines, and expand the production capacity scale of Pingshan Sealing and Testing Base and Module Factory to better meet the urgent needs of the market for storage products.

At present, Quantian Technology in the field of flash memory professional packaging and testing, can provide one-stop services by chip testing, packaging, finished product function testing, etc.; in the field of SiP packaging, Quantian Technology integrates high-density SMT patch and packaging technology, and will provide various types of system-level packaging services, including LGA packaging services for the storage, RF, and audio markets; in the traditional QFN market, Quantian Technology will provide packaging and testing services for power chips and RF chips; in the field of memory, Quantian Technology has a low-cost and high-efficiency test program in particle testing; in the field of packaging and testing, Quantian Technology BGA Phytosphere uses Laser Phytosphere technology to create a solder ball array on the SiP package, and the minimum process can be made to 100 um.

In terms of product strategy, in 2022, Quanxing Technology will increase R&D investment, focus on industrial control, RF packaging, sensor packaging and other characteristic packaging technologies and enterprise-level product areas, and expand the product line. Huang Shaowa pointed out that e-sports products will follow the rhythm of Intel's 12th-generation CPU product release to do synchronous planning, at that time, there will be different speeds of DDR5 product launch and high-speed solid-state drive collocation.

In terms of market strategy, Huang Shaowa said that in the next few years, the demand for domestic substitution of semiconductor memory will continue to be released, and the demand at home and abroad will continue to rise, which will bring huge market opportunities to domestic storage companies. In 2022, Quanxing Technology's sales volume and sales will double, and its revenue is expected to reach more than one billion yuan. (Proofreader/Kiyozumi)