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Wenyi Technology: 12-inch wafer packaging equipment is currently being tested

Wenyi Technology: 12-inch wafer packaging equipment is currently being tested

Jiwei network news, on January 20, some investors asked Wenyi Technology, 12-inch wafer packaging equipment is in development, or in debugging, when can it be delivered and used, and what is the progress?

Wenyi Technology: 12-inch wafer packaging equipment is currently being tested

Wenyi Technology replied that the equipment is currently being tested, and after the test is completed, it will be delivered according to the actual situation.

According to the data, Wenyi Sanjia Technology Co., Ltd. was established in April 2000, the registered capital of 158.43 million yuan, the predecessor of the company is the former Ministry of Electronics Industry affiliated to the 4150, 4963, 4524 three military factories, in 1988 from Yuexi to Tongling, in 1996 the three factories merged to form Sanjia Group, in 2000 the integration of mold plate business to establish a joint-stock company, in January 2002 landed on the Shanghai Stock Exchange, known as "the first share of Chinese mold".

The company currently employs more than 600 people, under the jurisdiction of a holding subsidiary, seven wholly-owned subsidiaries and two professional factories. The company's main business includes: semiconductor integrated circuit packaging molds and equipment, LED dispensers, plastic profile extrusion molds and equipment, belt conveyor roller bearing seats, seals, plastic steel doors and windows and aluminum alloy doors and windows. (Proofreading/New)

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