There are very few companies that can participate in high-end chip manufacturing, TSMC, Samsung, and Intel are also entering the high-end. The former two have accumulated a large number of high-end chip technology, and Intel is also accelerating the layout of the high-end chip market.
And the news came that the EUV lithography machine purchased from ASML has been in place, and TSMC's 3nm has also sent the time to put the film.
So, what are the news developments of TSMC and Intel in terms of high-end chips? What kind of changes will the high-end chip market usher in?
TSMC, Intel launched a high-end chip action
The chip industry chain has been transitioning to the high-end, and many technological advances are making breakthroughs based on chip manufacturers conquering high-end chips. TSMC's high-end strength is beyond doubt, and 7nm to 4nm can achieve stable mass production. Help Apple, Qualcomm, MediaTek and other large customers process various top chip processors.
But TSMC did not stop there, and is further exploring more advanced processes, and further down is 3nm. Regarding 3nm, some Taiwan media sources said that TSMC will officially put into production in August this year, and the planned monthly production capacity is more than 20,000 pieces.
TSMC has also said many times that the progress of the 3nm process has far exceeded expectations and will enter mass production in the second half of this year. Now that Taiwan media have reported that TSMC will put in motion in August, this action against another high-end process will determine TSMC's market position in the next craft era.
Not only TSMC, Intel has also launched a high-end chip action, and the EUV lithography machine provided by ASML has entered.
It is reported that Intel's Fab 34 plant in Ireland has delivered the first EUV lithography machine, which will be used for mass production of the Intel 4 process.
This is the largest and most advanced chip factory intel has built in Europe, and with the EUV lithography machine in place, Intel will also successfully carry out mass production of intel 4 chip process. In order to better accept this EUV lithography machine, Intel has made a lot of preparations, and the factory building facilities have made a lot of designs for the use of EUV lithography machines so that the plant can better control this top semiconductor equipment.
Intel has a clear plan to build a factory in Europe, and previously announced that it will invest 80 billion euros in Europe, which will be implemented within a decade.
Not only Ireland, Italy, Germany, Spain and other regions will become a major guarantee for Intel to lay out the high-end chip industry chain. Some do advanced packaging, some do chip manufacturing, in short, Intel will bring great industrial progress to itself through the European market, especially in the field of high-end chips.
Once the intel 4 is mass-produced, it will not be far from intel's final planned 20A process. If all goes well, then Intel could usher in the Amy era.
TSMC, Intel have sent news to carry out high-end chip action. Separately, TSMC's 3nm will be put into production in August, and Intel's EUV lithography machine has also been in place in the Irish factory, ready to mass-produce Intel 4 process chips. With the action of these two chip manufacturing giants unfolding, what kind of changes will it bring to the high-end chip market?
What kind of changes will the high-end chip market usher in?
All those who can participate in the high-end chip market competition are world-class giants, especially in the field of chip manufacturing, and many key technologies can only become substitutes if they cannot be mastered. Nowadays, TSMC, Samsung, and Intel will form a three-legged pattern in the high-end chip market, and the changes brought about are also very obvious.
The first is to create more possibilities for innovation in the technology market.
Chips have become an important guarantee for all walks of life to break through key technologies and improve performance levels. Taking the mobile phone industry as an example, today's smart phones are almost the same in design, and if you want to make greater progress in the industry and break the bottleneck of innovation, you must pursue higher-end chip performance.
From 7nm to the current 4nm, the iteration of each generation of high-end process technology will set off a wave of new machine release boom, and strive for the chip supplier's chip launch rights.
It's just that the iteration speed of smart phones is too fast, and 4nm may not be able to meet the industry's innovation needs. Therefore, once there is a breakthrough in the higher-end chip process, it is possible to achieve more possibilities for innovation in the technology market.
Secondly, the high-end chip market may usher in a reshuffle.
The original high-end chip market was divided by TSMC and Samsung, but Intel increased its chip manufacturing efforts, re-planned the chip process route, and now obtained the equipment of the EUV lithography machine into the factory.
In addition to these, the United States will also provide large subsidies to chip manufacturers, a total of $52 billion in chip subsidies, Intel can get at least more than $2 billion in subsidies.
With these advantages, Intel may form a peak trend with TSMC and Samsung in the future, so that the high-end chip market will usher in a reshuffle. And Intel will carry out chip foundry business like TSMC and Samsung. Therefore, it is not excluded that Intel will undertake chip orders from Chinese customers in the future.
summary
It is no exaggeration to say that TSMC and Samsung have supported half of the sky of chip manufacturing, and TSMC alone has produced chips with more than half of the market's production capacity.
Nowadays, Intel continues to exert efforts, and has also put chip manufacturing on the agenda, and various investment and construction actions continue to unfold. I only hope that domestic chips can also speed up, master core technologies in key market areas, and achieve better development for the future.
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