From Huawei's insistence that it has not given up the mobile phone business so far, it can be seen that Huawei is not as fragile as imagined, and its strength is still very strong and worthy of our expectations. So in terms of 5G, which everyone is most concerned about, is there any new progress for Huawei? The latest news hit, Huawei's three major technologies finally "broke the game", releasing a signal to the outside world: this time Huawei's 5G or finally stable!
First: to vigorously build the Hongmeng ecology, the ecological chain has taken shape
We know that Huawei's powerful Hongmeng system has been fully applied to mobile phones, covering many old models and new products of Huawei, and after market verification, Hongmeng system not only has a good fluency, but also compatible with Android software. The original intention of Hongmeng is to build for the Internet of Everything, smart cars, smart home appliances, transportation, communications and other technology fields outside the mobile phone, Huawei is also infiltrating the Hongmeng system, and now the ecological chain has gradually taken shape. Hongmeng is obviously developing rapidly and becoming more and more perfect, opening up an ecological barrier for 5G for the Internet of Things.
Second: 3D chip stacking packaging technology, breaking through the 5G blockade
In terms of hardware, Huawei has not given up on Kirin chips and technology research and development, it has disclosed the "a chip stacking packaging and terminal equipment" patent, which is a kind of area for performance, stacking for performance, can achieve low process to catch up with the possibility of advanced technology, at the same time it can also ensure power supply demand, solve the problem of high cost caused by the use of silicon through-hole technology.
Here to give you a popular science, silicon through-hole technology is a high-density packaging technology, can make the transistor integration is higher, the chip performance is stronger, but the process difficulty is also high, relying on the extreme ultraviolet light EUV lithography machine. The EUV lithography machine we all know that only ASML can provide, the price is high and the production efficiency is low, and the key is also limited, not to say that there is money to buy. Obviously, Huawei's patent can be a good bypass for ASML and bypass the EUV lithography machine. In addition, canon, a major lithography machine manufacturer, is also reported to be developing a 3D lithography machine, which is expected to allow Huawei to break through the 5G chip blockade.
Third: domestic manufacturers Fuman micro shipped 5G RADIO frequency chips, breaking the situation again
At present, Huawei cannot produce 5G mobile phones, mainly because of the lack of 5G RF chips, and foreign suppliers are restricted from selling to Huawei. However, it is reported that at present, two domestic companies have made breakthroughs in the field of 5G RF chips, of which the B20 5G RF chip launched by Ritcom will be used on 5G base stations and other equipment, and the 5G RF chip produced by Fuman Micro can be applied to smart phones and other devices. In this way, both domestic RF chips and Huawei will usher in a new turnaround and break the situation of 5G being limited again.
From the perspective of the above three major technologies, Huawei not only did not give up hardware chip technology, but also "forced" to develop software technology in advance, so we have reason to believe that Huawei's 5G will be stable this time.