Abstract: On the afternoon of December 13, according to a press invitation, Intel will invest 30 billion ringgit (about 44.5 billion yuan) to expand the production capacity of its semiconductor packaging plant in Malaysia.
On the afternoon of December 13, according to the information displayed in a press invitation, Intel will invest 30 billion ringgit (about 44.5 billion yuan) to expand the production capacity of its semiconductor packaging plant in Malaysia.
It is reported that the main purpose of this investment is to expand the production capacity of its semiconductor packaging plant in Malaysia, and further strengthen it as Intel's global service center by strengthening support for semiconductor packaging factories.
In addition to expanding production capacity, this investment is also inextricably linked to Intel's next development plan.
According to Intel's official release, intel will position Malaysia as one of the key centers of its manufacturing and sharing services in the future, and this decision has something to do with the current important role of Asian manufacturing to Intel.
On the other hand, the large number of factory closures caused by objective reasons in the past two years have seriously affected the development of its semiconductor industry, and the supply of chips by a large number of companies has been affected, especially Intel, which previously relied on the Malaysian market for the packaging of chips.
Previously, Intel's current CEO Pat Gilsinger had said that it would sacrifice short-term interests in exchange for Intel's major transformation in five years, and this large investment in a Malaysian semiconductor packaging plant should also be the embodiment of this strategy.
Source: Fast Technology
![Intel will invest $7 billion to expand the capacity of its chip packaging plant in Malaysia[fig]](data:image/gif;base64,R0lGODlhAQABAIAAAP///wAAACwAAAAAAQABAAACAkQBADs=)