Reuters: Intel will invest $7 billion in Malaysia to expand the chip packaging plant

On December 13, Reuters reported that Intel would invest 30 billion ringgit (about $7 billion) to expand its production capacity at its advanced semiconductor packaging plant in Penang, Malaysia. At the same time, the investment will also position Malaysia as one of the key hubs for manufacturing and sharing services.

In fact, in addition to Malaysia, the Indian government is also planning to attract chip manufacturers, including Intel, to invest.

The Indian government's earlier plan to attract foreign semiconductor manufacturers to set up factories has failed because the proportion of subsidies is too low, so it is ready to increase subsidies. According to Indian media reports, the local government plans to set up a budget of 760 billion Indian rupees (about 10.04 billion US dollars) to subsidize foreign companies to set up more than 20 semiconductor design, component manufacturing and display manufacturing plants in the next six years.

According to the report, officials from various government departments in India are actively discussing with semiconductor manufacturers such as TSMC, Intel, Ultramicro Semiconductor (AMD), Fujitsu and UMC. A senior official said, "Through different production linkage subsidy mechanisms, we are trying to broaden the scope of Indian manufacturing and exports, and the semiconductor policy will help deepen India's manufacturing base." ”

Its objectives include attracting foreign investors to set up 1 to 2 display manufacturing plants, 10 semiconductor design and component manufacturing plants each. It is reported that the plan may be sent to the Indian cabinet for approval next week.