Foreign media reports, Huawei is entering the field of semiconductor packaging and testing, the main reason for the packaging and testing related technology and equipment supply is less controlled by the United States companies, this strategy can reduce the impact of the United States blocking the road, in addition to cooperation with Fujian Province's Quliang Electronics, but also actively cooperate with panel factories to develop "panel-level chip packaging technology", but also make the technology become a hot topic in the industry.
Among the Taiwan factories, Pentronic, a large panel factory under Hon Hai Group, has invested in the advanced semiconductor packaging application of the panel-level process, with the fastest pace, and can meet the electronic system products towards light and short, efficient and energy-saving, multi-functional integration, and the semiconductor process continues to challenge the trend of miniature. With the accumulation of TFT LCD industry momentum for many years, Innolux has effectively filled the wire layer technology gap between fabs and printed circuit board factories through exclusive TFT process technology.
Innolux revealed that in addition to actively promoting commercial alliances with the production strategies of important international customers, Innolux also integrates upstream and downstream materials and equipment supply chain strategic partners of the front wire layer to jointly develop key solutions for panel-level fan-out packaging.
By activating the energy of its 3.5-generation panel production line, The substrate area of Innolux is about six times larger than that of a 12-inch wafer, which can significantly increase the area utilization rate to 95%, further provide customers with more competitive costs and create greater profit value, and provide packaging needs for various 5G, AIoT smart applications and other components.
Nikkei Asia Review quoted people familiar with the matter as saying that Huawei is actively entering the field of semiconductor packaging and testing, and recently cooperated with Quliang Electronics in Fujian Province, which expanded the production capacity of the Quanzhou plant, assisted Huawei to put its advanced chip packaging design into production, and tested some chip stacks and packaging technologies.
Huawei hopes to recruit experts from leading suppliers, including Sun Moonlight, and join hands with mainland giants such as BOE to develop panel-level chip packaging technology; it is reported that packaging and testing has become an important battlefield for global chip manufacturers such as Samsung, Intel and TSMC in seeking to produce more powerful chips.
Source: Taiwan Economic Daily
Cover image source: Paixin.com
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