The world's first semiconductor IC all-round laser mold cleaning robot.
Wen | the Jie snail system
Jieluo System has launched a new generation of AMR composite mobile robot - semiconductor laser cleaning robot with advanced technology, and has been applied in the world's largest packaging and test factory.
Jieluo Systems cooperates with the world's leading laser suppliers to develop laser mold cleaning robots. Previously, the founder of Jieluo System had managed the internationally renowned automatic IC plastic sealing equipment company. Therefore, we are very familiar with the design, manufacture, maintenance and cleaning of automatic plastic sealing, molds.
Jieluo Semiconductor Laser Mold Cleaning Robot replaces the manual mold cleaning operation of semiconductor factories in a fully automatic operation mode, which is a big step forward in promoting the realization of semiconductor unmanned factories.
Semiconductor IC packaging process requires plastic packaging (referred to as plastic packaging), more than 97% of the material using EMC (Epoxy Molding Compound), plastic sealing process is to use the transfer molding method to extrude EMC into the cavity, and the semiconductor chip in it is embedded, while crosslinking curing molding, becoming a semiconductor device with a certain structural appearance.
Its main functions are: to protect the chip from the influence of the external environment; to resist external moisture, solvents, and shocks; to make the chip and the external environment electrically insulated; good installation performance; to resist thermal shock and mechanical vibration during installation; thermal diffusion and so on.
Plastic packaging using semi-automatic or fully automatic plastic sealing equipment, usually there are 2 to 4 sets of molds in the equipment, the mold by heating the EMC into the GAP of the IC frame to seal each IC. Every time you finish a process, you need to do a mold cleaning action to clear the residual plastic.
In the transfer molding packaging process used in general semiconductor devices, mold cleaning is a seemingly insignificant process, but it is actually a very important process.
On the one hand, in continuous molding operations, some components from the plastic sealant and the release agent are oxidized at high temperatures (170 ° C ~ 180 ° C) and attach to the surface of the mold, forming a dirt that is difficult to remove. If it is not cleared in time, it will not only cause difficulty in packaging release and defects in the appearance of the package body, but also cause damage to the mold cavity surface.
On the other hand, the daily routine mold cleaning process consumes as little as 1 to 2h, more than 3h time, for most of the current domestic packaging and test factories, relative to the number of orders is stretched out of production capacity, it is definitely an unusually long process.
The current traditional semiconductor molding mold method:
(1) Use the mold cleaning strip for 2 to 5 times;
(2) 5 to 8 times of mold cleaning treatment with the mold clearing cake;
(3) Use the mold material for mold treatment.
The mold cleaning material is heated and cured on the semiconductor plastic mold to complete the cleaning effect on the mold.
However, at present, when producing rubber-based mold cleaning materials, a large number of small molecule compounds with certain toxicity will be used organamine alcohols (such as ethanolamines), and when using rubber-based mold cleaning materials, organic amines (such as ethanolamines) are volatile, resulting in serious pollution of the environment when producing and using such mold cleaning materials, and even harming the body of operators.
The working principle of laser mold cleaning:
Laser cleaning, also known as laser ablation, uses thousands of laser pulses per second to absorb contaminants and remove them from the product substrate without damaging the mold.
Laser systems are used with no additional waste and virtually no risk, making them the ideal solution for cleaning molds. In addition, laser cleaning does not degrade the product – making it a cost-effective solution for cleaning metals and non-metals.
Laser cleaning molds has several benefits. The most common include:
Remove contaminants without damaging molds, machines or equipment
Easy to set up and operate
Suitable for all metal mold types
Cost-effective and very low operating costs
environmental protection
There is no damage to the human body
About the Jet Snail System
Focusing on semiconductor mobile robot applications, Jieluo Systems provides intelligent handling AMR robots, including supporting electronic shelves, wafer stocker intelligent warehousing systems, and semiconductor equipment automation transformation services. And independently developed software such as dispatch system and real-time delivery system to provide a complete solution for intelligent handling of semiconductor factories.