Jiwei Network News (Text/Wu Jiaxi) On March 3, 2021, Zhongwei Semiconductor Equipment (Shanghai) Co., Ltd. (hereinafter referred to as "Zhongwei Company") "issued A-share shares to specific targets to raise funds" registered on the Shanghai Stock Exchange and came into effect.
It is understood that Zhongwei Company is mainly engaged in the research and development, production and sales of semiconductor equipment, and achieves revenue and profits by selling plasma etching equipment and MOCVD equipment to downstream integrated circuits, LED chips, advanced packaging, MEMS and other semiconductor product manufacturing companies, providing accessories or services.
In the manufacturing process of 3DNAND chips, Zhongwei's capacitive plasma etching equipment can be applied to the mass production of 64 layers, and Zhongwei is developing a new generation of etching equipment and processes that can cover 128 layers of key etching applications and corresponding extremely high aspect ratios according to the needs of memory manufacturers. In addition, Zhongwei's inductive plasma etching equipment has been mass-produced on the production lines of a number of logic chip and memory chip manufacturers, and according to the technical development needs of customers, the technology research and development of next-generation products is being carried out to meet the ICP etching needs of logic chips below 7 nanometers, DRAM chips below 1X nanometers, and 3DNAND chips with more than 128 layers, and to conduct research and development of high-output ICP etching equipment.
Zhongwei Company said that the company's current development of products are mainly plasma etching equipment, thin film deposition and other key equipment produced in the front of the semiconductor, and gradually develop advanced packaging, MEMS, blue-green light and ultraviolet LED, MiniLED, MicroLED and other pan-semiconductor equipment products. In the future, while strengthening endogenous growth, Zhongwei Company will expand its product and market coverage through epitaxial growth channels such as mergers and acquisitions at an appropriate time, and will continue to explore the innovative application of core technologies in the national economy and people's livelihood.
It is planned to raise 10 billion yuan for the construction of projects such as the micro-industrialization base
The total amount of A shares issued by Zhongwei Company to specific targets shall not exceed 10 billion yuan (including the principal amount), and the net amount of the total funds raised after deducting the issuance fee will be used in the following directions:
1. Construction project of Zhongwei industrialization base: the total planned investment is 3,177,326,600 yuan. Among them, it is planned to invest 317,000.00 million yuan in raised funds.
It is reported that the total area of the construction project of the Zhongwei Lingang Industrialization Base is about 157.5 mu, and the planned total construction area is about 180,000 square meters; the construction project of the Zhongwei Nanchang Industrialization Base covers an area of about 130 mu, and the construction area of the proposed new production base is about 140,000 square meters. After the project is completed and put into production, it will be mainly used for the production of integrated circuit equipment, production and testing equipment in the field of pan-semiconductors, and some parts. Among them, the Lingang industrialization base will mainly undertake the capacity expansion of the products of Zhongwei Company and the development and production of new products; the Nanchang Industrialization Base will mainly undertake the large-scale mass production of more mature products and the research and development and upgrading of some products.
2. Zhongwei Lingang headquarters and R&D center project: Zhongwei Lingang headquarters and R&D center will be established in Shanghai Lingang New Area, and a full-cycle R&D platform from product technology research and development, sample manufacturing and simulation testing to large-scale industrial production will be built. At the same time, this project will carry out research and development work on the manufacture of related products and equipment in the field of high-end semiconductors and pan-semiconductors according to the development trend of the integrated circuit industry and market demand. The total area of the project plot is about 25.05 mu, and the planned total construction area is about 105,000 square meters. After the completion of this project, it will become the headquarters and R&D center of Zhongwei Company, integrating functions such as office, research and development, testing and service, and meeting the R&D needs of integrated circuit equipment, pan-semiconductor equipment and key components of Zhongwei Company from the level of hardware facilities.
3. In order to meet the growing operating capital needs of R&D projects of Zhongwei Company, 308,000.00 million yuan of the funds raised this time are science and technology reserve funds. The technology reserve funds will be used to meet the needs of working capital, research and development, and expansion of related industries.
(Proofreading/Andy)