Jiwei Network News, Jiangfeng Electronics released its 2021 annual report on April 26, 2022, saying that the net profit attributable to the owners of the parent company in 2021 was 107 million yuan, a year-on-year decrease of 27.55%; operating income was 1.594 billion yuan, an increase of 36.64% year-on-year; basic earnings per share was 0.47 yuan, a year-on-year decrease of 29.85%.
On the same day, Jiangfeng Electronics' first quarterly report showed that the company achieved operating income of 490 million yuan, an increase of 54.29% year-on-year; Net profit attributable to shareholders of listed companies was 33.4435 million yuan, an increase of 90.15% year-on-year; Net profit attributable to shareholders of listed companies, net of non-recurring gains and losses, was RMB42.3597 million, an increase of 94.75% year-on-year; Basic earnings per share were RMB0.14 per share.
Jiangfeng Electronics said that during the reporting period, the product market promotion has made significant progress, ultra-high purity tantalum targets and ring parts, ultra-high purity copper and copper manganese alloys and other types of targets through the international first-class customer evaluation, the purchase volume continued to increase, especially the tantalum target in TSMC, Hynix, SMIC and other important customers the purchase volume increased significantly, tantalum target sales increased by 28.02% over the same period last year. Ultra-high purity aluminum targets and ultra-high purity titanium targets further show the advantages of localization of materials, and further expand their market share in the world, and the growth rates of ultra-high purity aluminum targets and ultra-high purity titanium targets are 30.95% and 35.72% respectively. Copper manganese, copper and aluminum alloy targets have passed the mass production evaluation of important customers such as TSMC and Huahong Hongli, and successfully began to obtain bulk orders.
The company has become an international mainstream supplier of ultra-high purity target materials, which has been widely recognized by customers. Through close cooperation with customers, tracking international cutting-edge technology, a series of achievements have been achieved, such as 300mm ultra-high purity titanium target has been mass production delivered in the international famous IDM memory chip head factory; after more than 10 years of hard research and development, the successfully developed HCM copper target has been batch ordered by the world's first-class chip foundry manufacturing plant; LCD molybdenum target for 6 generations and 8.5 generation line molybdenum target and 8.5 generation copper rotating target have passed the evaluation of many customers and successfully entered the batch application. The company's products have entered the leading 5nm technology node, and continue to maintain a leading position in the field of semiconductor targets.
According to Jiangfeng Electronics, in recent years, the company has continued to invest in the research and development of parts manufacturing processes, invested in strengthening equipment capabilities, built a full-process and full-process production system for parts production, built three parts production bases in Yuyao, Ningbo, Fengxian in Shanghai, and Shenbei in Shenyang, and realized the mass production of multi-variety, large-scale and high-quality parts. It has filled the production capacity gap of the domestic parts industry, and formed strategic cooperation with many manufacturers such as the domestic semiconductor equipment leader North Huachuang, Tuojing Technology, Core Source Micro, Shanghai Shengmei, Shanghai Microelectronics, Yitang Technology, etc., and accelerated the volume of various semiconductor precision parts and components newly developed.
During the reporting period, the company's parts sales were 184.1786 million yuan, an increase of 239.96% over the same period of the previous year. The company's newly developed various precision parts and components products have been widely used in PVD, CVD, etching machines and other semiconductor equipment, in a number of chip manufacturing enterprises to achieve domestic substitution, and semiconductor equipment manufacturing enterprises joint research and mass delivery. The rapid mass production and sales of new products reflect jiangfeng electronics' leading technology, advanced production management level and strong market expansion capabilities.
Jiangfeng Electronics pointed out that the company has a strong ability of technology and product innovation, has become a leader in the domestic high-purity sputtering target industry, and competes in the global market with American and Japanese multinational companies. In the face of a broader market space for semiconductor equipment, liquid crystal displays, solar cells and other application areas, the company has formulated the corresponding product development and market expansion plan, while continuing to consolidate the leading position in the field of semiconductor chip applications, but also can use the technology, brand and customer resources accumulated in the semiconductor chip market to quickly penetrate into new application areas, so as to achieve rapid and stable growth.
Jiangfeng Electronics said that the company implements a strategic layout around five aspects: horizontal expansion of product lines, vertical extension of industrial chains, major equipment and core technologies, globalization of production services, and construction of corporate culture, in order to achieve the company's strategic development goals, and the specific development strategies are as follows:
1. Rooted in the field of ultra-high purity metal and sputtering targets, improve the horizontal layout of precision parts of semiconductor equipment, and serve the chip and panel industry
(1) In the field of ultra-high purity metal and sputtering targets, the company will continue to track the most advanced integrated circuit technology in the world to consolidate the competitive advantage of the company's high-purity sputtering target products in the semiconductor field; at the same time, expand the application of large-size ultra-high purity target manufacturing technology, and achieve sales growth in the fields of flat panel displays, touch screens, wearable electronic devices and other fields.
(2) In the field of precision parts of semiconductor equipment, the company has accumulated rich experience and technical reserves in terms of metal material characteristics and processing, and has a more mature management system and cultural system, which can strictly follow the requirements of the semiconductor industry to ensure the consistency of product quality. Therefore, the company has strong competitiveness in the field of R&D and manufacturing of precision parts for semiconductor equipment. In the future, the company will further increase investment, improve the business layout of precision parts of semiconductor equipment, gradually realize the localization of precision parts of semiconductor equipment, and help the key components of domestic semiconductor equipment enterprises to be independently controllable.
2. Vertically integrate the production system and extend the layout of the upstream and downstream of the industrial chain
Ultra-high purity metal sputtering target is the key core material of chip manufacturing, and its industrial chain links cover many technical difficulties such as ultra-high purity metal purification, casting, crystal structure control, special welding, machining, surface treatment, analysis and testing. In order to ensure the safety and controllability of the product supply chain and enhance profitability, the company is laying out a stable and secure supply chain system in China through commercial cooperation and equity investment.
3. Build research and development capabilities for key production equipment, increase investment in research and development, and form core competitiveness
The company has independently developed and customized the key manufacturing equipment of the target material, equipped with a full set of equipment including plastic processing, welding, surface treatment, machining, analysis and testing of the target, and built a relatively complete system for the protection of independent intellectual property rights. The company will continue to increase investment in research and development to lay a solid foundation for future development. (Proofreader/Li Zhengcao)