Recently, according to the "Electronic Times" quoting sources, Samsung and Micron may be mass-producing 3D NAND flash memory chips above 200 layers, and the flash memory industry has officially entered a new process era.
The person said that Samsung's new plant in Pyeongtaek, South Korea, will start production in the second half of 2021 and will increase the production of 176-layer 3D NAND chips this year. The transition to 176-layer 3D NAND flash fabrication is expected to boost the total output of Samsung's new plant to 50,000 wafers per month in 2022.
In addition, Samsung's decision to integrate its dual-layer technology into its 176-layer 3D NAND manufacturing process can accelerate its transition to a 200-layer generation or more and help expand its technological leadership over competitors.
As early as January 2022, Micron announced that it had begun mass shipments of its claimed industry's first 176-layer QLC NAND SSD hard drive. The company has previously said it will strive to gain a larger share of the industry's profit pool rather than grow its share of the industry's output.
Therefore, Samsung and Micron may take the lead in the 200-layer NAND particle competition.
(7862150)
![278 million yuan! Yaxiang Integrated won the bid for the National Memory Base Project (Phase I) FAB2 and so on[fig]](data:image/gif;base64,R0lGODlhAQABAIAAAP///wAAACwAAAAAAQABAAACAkQBADs=)