IT Home news on January 8, Huajin Semiconductor successfully completed the first batch of equity financing of more than 200 million yuan in the A round.
In December 2021, Huajin Semiconductor Packaging Pilot Technology R&D Center Co., Ltd. successfully completed the first batch of financing in the A round, which attracted shenzhen venture capital, Turing fund and Wuxi local industry investment fund to join. After this financing, the company's registered capital increased to 329 million yuan, which will help promote the company's investment and construction in the National Integrated Circuit Characteristic Process and Packaging and Testing Innovation Center (Huajin Phase II) and Huajin (Jiashan) Advanced Packaging Project (Phase I) in Xinwu District, Wuxi City as soon as possible, on the one hand, improve the research and development and upgrading of integrated circuit advanced packaging, promote the high-density integration, performance improvement, volume miniaturization and cost reduction of advanced packaging chips, on the other hand, further accelerate the pace of industrialization of advanced packaging of the company. Expand the share of the company's integrated circuit packaging and system integration products, and enhance the company's comprehensive competitive advantage and profitability.
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