AMD Zen4 exposure: IPC increased by 25%, frequency breakout 5GHz

AMD has previewed some of the information on the Zen 4 architecture at the CES 2022 event on January 4.

Some whistleblowers stole some details about Zen 4, not knowing that they would eventually be able to sit on the geometry.

Specifically, AMD Zen4 is based on TSMC's 5nm process, I/O Die is 6nm, IPC is 25% higher than Zen3, and the factory frequency will break through 5GHz.

Zen4 corresponding consumer processor is the Ryzen™ 7000 series, using AM5 interface (LGA1718), supporting dual-channel DDR5 memory (not supporting DDR4), 28 PCIe 4.0 channels, supporting NVMe 4.0, USB 3.2/4.0 and other transmission features.

Previously, there was also a widely circulated rumor that the Ryzen™ 7000 desktop CPU would integrate GPU units, up to 4CU (256 six processors), but the architecture was RDNA2, so it could still kill Intel's core display.

In addition, the X670 chipset is paired with the Zen4 Ryzen™ 7000, because of the large area, it is no longer possible to do ITX and the following small board.