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News丨AMD Ryzen™ 7000 processor or will be released in Q3

During CES 2022 at the beginning of this year, AMD officially announced its next-generation Zen4 processor, the desktop product will be named Ryzen 7000 series, manufactured in a 5nm process, AM5 LGA1718 package interface, support DDR5 memory, PCIe 5.0 bus. In terms of release time, AMD CEO Dr. Su Zifeng gave the time in the second half of this year, and there is no specific time.

News丨AMD Ryzen™ 7000 processor or will be released in Q3

However, just recently, the whistleblower @Greymon55 said that the Ryzen 7000 series processor will be released in the third quarter, and the AM5 motherboard test sample will soon be produced.

The outside world speculates that this time AMD released a new generation of products so early should feel the pressure of the 12th generation of Core, the current Ryzen 5000 series has been released for a year and a half, 3D cache upgrade version only one model Ryzen 7 5800X3D, until March to list, the impact is limited.

News丨AMD Ryzen™ 7000 processor or will be released in Q3

Judging from the current news, the Zen4 architecture of the Ryzen™ 7000 series in the CCD computing unit will be TSMC 5nm, the IOD input and output unit is TSMC 6nm, support AMD RAMP one-click memory overclocking (similar to Intel XMP 3.0), PCIe 5.0 channels number of 28, also support NVMe 4.0, USB 3.2 (may have USB4), high-end model hot design power consumption of 105-120W, up to about 170W. And it will fully integrate RDNA2 GPU, and the core display performance will be further improved.

News丨AMD Ryzen™ 7000 processor or will be released in Q3

In terms of graphics cards, foreign bloggers have recently exposed the information of AMD's flagship model RX 7900XT in the next generation RX 7000 series, according to the news, it is expected that RX 7900 XT may be released in December this year, listed in the first quarter of next year, and the price may be set at 1999 US dollars.

In terms of performance, according to the previous revelations, the RDNA3 architecture will use MCM multi-chip packaging, of which the 5nm process creates the computing core, and the 6nm process creates the IO core. The RX 7900 XT may use MCM multi-chip packaging technology, and its corresponding Navi 31 large core stream processor number will be as many as 15360, which is 3 times that of the RX 6900 XT.

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