AMD has successively released three products of the Instinct MI200 series of accelerated computing cards, MI250X, MI250, MI210, the next generation is also on the way, the authoritative exposure master MILD gave a large wave of interesting information.
The MI200 series is the first to use a 2.5D dual-core package, and the MI300 series will evolve to multiple small chip 3D integrated packages, similar to the Intel Ponte Vecchio, but less large and complex.
MI200 Series
MI300 Series
The interior of the MI300 can be roughly divided into three layers, the bottom layer is a huge interposer (Interposer), an area of about 2750 square millimeters, MLID bluntly said that this is the largest he has ever seen.
Above the mediation layer is a series of 6nm process base Die (base chips), which can also be called tiles, integrating IO Die responsible for input and output, various other IP modules, and possible caches, each with a block area of about 320-360 square millimeters.
Above each 6nm block, there are two 5nm processcompute Die (computing chip), a single area of about 110 square millimeters, the interior is a variety of computing cores and related modules, but it is said that different modules can be customized to meet different computing needs.
At the same time, each computing chip corresponds to one HBM3 high-bandwidth memory, and the capacity is temporarily unknown.
There are up to 20,000 connection channels between the different Die, about twice as many as the Apple M1 Ultra.
The number and combination of various Die can be flexibly customized, and the most common medium configuration is 2 6nm base chips, 4 5nm computing chips, and 4 HBM3s, for a total of 10.
The most high-end should be doubled, 4 basic chips, 8 computing chips, 8 HBM3, a total of 20, the power consumption is expected to be about 600W, and the current top configuration is basically the same.
Oh yes, PCIe 5.0 is also supported.