Intel orders high NA lithography machines:
Although Intel will seek TSMC's foundry services in the coming years, it has never given up on developing its own manufacturing capabilities. Intel has just announced ordering the latest TWINSCAN EXE: 5200 high numerical aperture EUV lithography machine from ASML.
Around 2025, semiconductor processes will enter the Am-scale (1 Angstrom = 0.1 nm), and high numerical apertures are critical to achieving smaller transistors and higher transistor densities. The ASML Twinscan EXE with a value of 0.55 aperture: The 5200 also offers higher productivity and can complete 200 wafers per hour, while the Twinscan NXE: 3600D with a bore size of 0.33 can only complete 160 pieces per hour.
Intel will be the first user of the TWINSCAN EXE:5200, which plans to start manufacturing in 2025 using high-value aperture EUV lithography. Intel is expected to use it to complete its 18A (~1.8nm) process.
MediaTek WiFi 7 Technology Demo:
MediaTek has just conducted the world's first live demonstration of WiFi 7 technology, demonstrating the ultra-high-speed and low-latency transmission capabilities of the technology. WiFi 7 achieves transmission speeds of up to 30Gbps through multilink aggregation, which is 2.4 times faster than current WiFi 6 when using the same number of antennas.
Alan Hsu, vice president and general manager of MediaTek's intelligent connectivity business, said WiFi 7 technology will be the backbone of home, office and industrial networks, and provide seamless connectivity for multiplayer AR/VR applications, cloud gaming, 4K calling, and 8K streaming applications.
MediaTek expects products with WiFi 7 to begin on the market in 2023. Of course, this is a more optimistic expectation, and the final version of the WiFi 7 standard may not be released until 2024.