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Today to talk to you about: TSMC began to fight back, new technology has been used on Apple chips, ASML has become "cannon fodder"!
If each country wants to lay out the future industry, the demand for high-end chips is inseparable, after the in-depth construction of the digital age, the importance of chips has become more prominent, although the current mass production process has reached 4nm, but the impact of Moore's Law on the entire chip industry can not be underestimated, especially under the relevant restrictions, the development of chip manufacturers is more limited, and it is more difficult to further improve the performance of chips.
After going to the United States to build a factory, TSMC's free shipping right has been affected, in order to solve such a dilemma, the current TSMC has also officially opened the "de-beautification" of technology, the biggest dilemma is stuck on the lithography machine, although the ASML that manufactures the equipment is not a US company, but the use of a large number of US-containing technology, the shipment of products must be controlled, after the birth of TSMC's new technology, ASML is destined to become "cannon fodder"!
TSMC began to fight back
Entering 2022, the major chip manufacturers have made a big breakthrough, and the biggest highlight is that Apple officially unveiled the new M1 Ultra chip at a spring conference on March 9, and the "new" of this chip is a bit special, not in the process of upgrading, but directly combining the two M1 chips, after the superposition of the two chips, at least 40% in performance.
And this technology is also known as "double core superposition", is TSMC using the most advanced packaging technology to achieve, and the chip equipped with this process is also called "small chip", once this technology achieves a better breakthrough, it means that the lithography machine will lose a specific position, but also can accelerate TSMC to get rid of the United States of Technology dependence, then what impact will the birth of such technology have on TSMC?
The impact of TSMC's new technology on the market
On March 14, there was such a news: "After the landing of the $52 billion chip bill, the demand for high-end chip talents will further increase, at least 3,500 talents will be imported from overseas, and the target is TSMC and Samsung's internal employees!" ”
So blatantly to "dig people", presumably only they can do it, the main reason is to rely on the United States of technology, so at present TSMC does not dare to reject them, can only be forced to arrange technical personnel to them, for the lack of technical personnel in the chip field, each talent has a certain value, in the end the competition of science and technology is the competition of talents.
But after the birth of TSMC's advanced packaging technology, there is a way to get rid of the EUV lithography machine dependence, it can be said that it fully has the strength of technology "de-beautification", once this step is completed, presumably lao Mei does not dare to blatantly dig people, TSMC also has enough confidence to refuse, after all, the lack of advanced process technology of the United States companies, but also highly dependent on TSMC technology.
Some time ago ASML announced, Intel will give priority to a new generation of EUV lithography machine, is expected to be completed in 2025, when it can meet the conditions for the production of 1nm chip, Intel is also increasing research and development efforts, the future is likely to become TSMC's biggest competitor, and the priority supply of lithography machine has been taken away, there is still a great threat to TSMC.
Therefore, TSMC began to develop advanced packaging and testing technology, this direction is correct, both to achieve chip performance improvement, but also to get rid of the dependence on U.S. technology, which is a two-for-one way, after TSMC completely got rid of U.S. technology, the source of customers is not limited to U.S. companies, and Huawei's cooperation or will be re-elevated agenda, its potential can not be smaller than any U.S. company.
Possibility of resuming supply to Huawei
China, as the world's largest consumer market for chips, has long relied on imported chips to support the development of science and technology, until the birth of Huawei's Kirin chip, which has largely alleviated such a dilemma, but under the relevant restrictions, the development of domestic chips has once again fallen into a dilemma, but Huawei's willpower is firm, and in the predicament, instead of giving up the continued research and development of chips, it is also dismissive of the communication to restore supply.
Obviously, Huawei wants to achieve the complete autonomy of chips, rather than relying on overseas technology to achieve profitability, but if the relevant restrictions are not lifted, TSMC can not restore supply, unless TSMC can use advanced packaging and testing technology to fully realize the autonomy of chip manufacturing, then it will certainly be possible to resume cooperation, but there is a lot of uncertainty in technology research and development, and Huawei definitely wants to take the initiative.
At present, Huawei has localized all the industrial chains that can be replaced, and the domestic lithography machine is also accelerating the layout, including the underlying EDA design software and chip architecture, which is also accelerating research and development, according to many previous news confirmed that the fully autonomous industrial chain should not be far from being realized, and the direction of TSMC's new technology is also worth learning from domestic enterprises.
ASML is destined to be "cannon fodder"
ASML has always wanted to enter the Chinese market, naturally see the potential of the Chinese market, but suffering from the inability to obtain the authorization of free shipment, everything has become empty talk, although according to the previous public data show that the order of EUV lithography machine is still in short supply, and even doubled in revenue, but this still can not hide the fact that it encountered difficulties, ASML will become the biggest "cannon fodder"!
Now TSMC's advanced packaging technology has been realized, the follow-up probability will continue to go in this direction, the future of the EUV lithography machine will gradually reduce the dependence, and now the priority licensing to Intel, will further compress the living space of the international market, which is extremely unfavorable for ASML, Bench power this time counterattack, do you think ASML can hold up?