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Medika: Signed a contract with Toppan SMIC for the commissioned processing of CIS wafer optical path systems

Medika: Signed a contract with Toppan SMIC for the commissioned processing of CIS wafer optical path systems

Jiwei Network news, on the evening of January 18, Medica issued an announcement that on January 18, 2022, Toppan SMIC Color Crystal Electronics (Shanghai) Co., Ltd. (hereinafter referred to as: Toppan SMIC) signed the "Image Sensor (CIS) Wafer Optical Path System Commissioned Processing Contract" (hereinafter referred to as "this agreement") with Zhejiang Medica Optical Semiconductor Co., Ltd., a wholly-owned subsidiary of the company, and actively developed the Chinese mainland OCF market and established a cooperative relationship.

It is understood that the cooperation content is that Toppan SMIC provides image sensor (CIS) wafers to Zhejiang Medica Optical Semiconductor Co., Ltd. free of charge, and Zhejiang Medica Optical Semiconductor Co., Ltd. performs optical path system processing services for color film (OCF) and micro lens (ML) on the wafer.

According to the data, the business scope of Toppan SMIC is the design of imaging sensors; the design, production, and processing of wafer color films/miniature lenses and their related products, the processing of wafer wafers, and the assembly of molds.

It is understood from the announcement that the term of this contract is 3 years, starting from January 18, 2022 to January 17, 2025, unless terminated earlier in accordance with the provisions of this contract.

Medika said that the agreement signed this time is a cooperation agreement, does not involve the specific transaction amount and content, and there is uncertainty about the impact on the company's operating results in 2022 and future. (Proofreading/New)

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