IT House December 29 news, today realme once again warmed up the real me GT2 series mobile phone, and announced the internal structure rendering. The phone will be equipped with a diamond ice core cooling system Plus, with an "industry ceiling-level heat dissipation area" of 36761mm. The mobile phone has a large tempered VC liquid-cooled vapor heating plate with an area of 4129mm.
This heat-depleting board completely covers the motherboard area and most of the battery area, and is expected to suppress the heat of the Snapdragon 8 Gen 1 chip.
From the poster, it can also be seen that the upper left corner of the mobile phone has a large outsole main camera, the mobile phone motherboard structure is very compact, and the front camera is located in the upper right. The phone is equipped with a dual battery, an integrated middle frame, and components such as an earpiece in the center.
According to it's previously reported by IT Home, realme GT2 Pro will be equipped with Samsung 2K flexible screen, resolution 3216×1440, support 120Hz high brush, using LTPO technology. The phone's screen size is expected to be 6.7 inches, with a maximum touch sampling rate of 1000Hz.
Realme Gt2 Series phones will be officially released on January 4.