The upcoming Redmi K50 series will be led by the K50 esports edition – in the days after that, there are enough warm-up news about the Redmi K50, and today there is a poster with the spokesperson Wang Yibo.
The day before yesterday, the Redmi brand officially released the heat dissipation material about the K50 e-sports version, which uses a VC heating plate with an area of up to 4860 mm, which will be the largest area of the internal heating plate used in the smartphone today.
Not only beyond the level of the Xiaomi Mi 12 Pro, but also beyond the realme GT2 Pro's 4192 mm, here we also sorted out the ranking of the VC cooling area of some models, including the K50 gaming edition:
1. Redmi K50 Esports Edition - 4860mm VC vaporizer;
2、 realme GT2 Pro - 4192mm VC vapor heating board;
3、 iQOO 9 Pro - 3926mm VC vapor heating board;
4. iQOO 9 - 3923mm VC vapor chamber;
5、 OnePlus 10 Pro - 3161.09mm VC vapor plate;
6、Xiaomi Mi 12 Pro - 2900mm VC heating plate;
7. Xiaomi Mi 12 - 2600mm VC vapor heating plate.
But the question is, what exactly is a VC vaporizer? Does it really improve body heat? Why has it been mentioned and publicized by major manufacturers in the past two years, and even sent to mid-range models?
▉ Mobile phone heat dissipation, what is the dissipation? How to scatter?
We know that the vast majority of the heat of contemporary smartphones comes from the dragon, ah, no, from the brain SoC chip of the mobile phone, and then the battery, camera, screen and other devices.
The so-called "heat dissipation" is to transfer the heat generated by these devices, especially the SoC, to the fuselage shell, through which the heat is dissipated to the outside.
▲ Xiaomi Mi 12 Pro internal structure explosion diagram
Nowadays, the interior of the mobile phone has long been crowded, so that the heat can be freely transmitted to the fuselage shell without induction, which is extremely inefficient, and it is necessary to transfer the heat to the mobile phone shell with the help of heat dissipation materials.
The so-called heat dissipation material is actually a thermal conductive material, such as copper foil, graphene thermal radiation paste, thermal grease, liquid-cooled heat dissipation pipe, etc., and the aforementioned VC vaporizer plate is a relatively new heat dissipation material inside the mobile phone.
▲ Explosion diagram of the internal heat dissipation structure of the realme GT2 Pro
The level of the fuselage temperature mainly reflects the heat generated inside the mobile phone, measuring whether the heat dissipation is done well, it is important to look at the uniformity of the fuselage heat - imagine that after a mobile phone runs under high load for a period of time, only a small area of the back is recorded at 48 ° C, and the remaining part is 28 ° C, largely because the internal heat conduction is not uniform, the internal heat is too concentrated, and the internal heat cannot be shared with the help of a larger area of the fuselage shell to help dissipate heat - if the heat is distributed to a larger area, It can not only reduce the maximum temperature of the fuselage, but also help to dissipate heat on the surface of the fuselage.
Therefore, the role of heat dissipation material is to assist and accelerate the transfer of heat to the fuselage shell, and efficient heat dissipation material is one of the keys to heat dissipation of the fuselage.
▉ What is a VC vapor chamber?
VC is the abbreviation of Vapor-Chamber, literally translated as "evaporation chamber", manufacturers generally translate as "exhaust heat plate", strictly speaking, it actually refers to "vacuum chamber vapor chamber heat dissipation technology".
The VC heat shield is said to have been developed by Celsia, a thermal solution manufacturer, to achieve more effective heat dissipation for AMD's high-performance graphics cards, and is now more commonly used in flagships and even mid-range smartphones.
The VC vapor chamber is actually a kind of liquid-cooled heat dissipation material, which is an "enhanced version" of the traditional liquid-cooled heat dissipation tube.
▲ "Liquid cooling heat pipe" structure and heat conduction diagram
First of all, the heat conduction principle of "liquid-cooled heat pipe" is actually similar to the "water-cooled heat dissipation" on the computer, which is to continuously evaporate (absorb heat) and condense (exothermic) of coolant in a closed pipe to transfer heat, and the disadvantage is that the area covered by the "tubular" design is still relatively small.
▲ Schematic of the structure of the VC vapor plate
VC vapor plate, first of all, it is a liquid-cooled "board", not "tube", although it is the use of the principle of gas-liquid phase change, constantly evaporate the coolant, condensation to transfer heat, but the vapor plate is more than the ordinary heat dissipation copper tube more than a dimension, from the "line" dimension to the "surface" This higher dimension, heat distribution is more uniform, the effect of heat dissipation is theoretically better, but the process is complex, the cost is relatively high, which is also the reason why the current heat dissipation technology is mostly used in flagship mobile phones, Only a small number of manufacturers are willing to apply this to mid-range models.
Therefore, manufacturers are desperately promoting the "fierceness" of their product materials and showing the large area of VC vaporizers.
▉ Is the larger the VC vapor plate area, the better?
Theory is so, but is it really true that the larger the area, the better the heat dissipation?
In order to get the answer to this question, we selected several flagship phones equipped with the Snapdragon 8 Gen 1 platform and equipped with VC vapor plates inside - Xiaomi 12 Pro, OnePlus 10 Pro, realme GT2 Pro and vivo iQOO 9 Pro, compared with the "five-hour endurance" test data tested by our WHYLAB lab, combined with the VC vapor plate area used by each, to see if the larger VC vapor plate area will have a positive impact on the heat dissipation of the fuselage.
The first is the smallest area of the four VC vaporizers, that is, the 2900mm model Xiaomi Mi 12 Pro, which recorded a maximum temperature of 39.9 °C on the back and 41.7 °C on the front in the five-hour endurance test.
Then look at the second smallest VC area of the four mobile phones, one plus 10 Pro, a total of 3161.09mm, its five-hour endurance test recorded the highest temperature on the back of 38.9 °C; the front 40.2 °C.
Look at the second largest iQOO 9 Pro, which has a 3926mm VC vapor plate, which recorded a maximum temperature of 38.4 °C on the back and 41.2 °C on the front in the five-hour endurance test.
The largest realme GT2 Pro, with a VC vapor plate area of 4192mm, recorded a maximum temperature of 38.2°C on the back and 39.7°C on the front in its five-hour endurance test.
Above temperature data, we mainly look at the maximum temperature on its back: 39.9 °C, 38.9 °C, 38.4 °C, 38.2 °C - it is indeed found that the larger the VC vapor plate area, the lower the temperature.
However, temperature control and heat dissipation is a software and hardware with the system, systematic overall engineering, smart phones as a whole, the various subsystems need to assist each other, but also will be mutually restrained, even if the performance of this "small system" can not only look at the heat dissipation, can not only rely on the "pay" of a unit, in addition to the VC heat dissipation board, there are other heat dissipation components in the mobile phone design to help dissipate heat, and SoC power consumption, manufacturers' tuning, internal materials, layout design, etc. Both combine to affect the temperature that is ultimately reflected in the fuselage.
Therefore, in theory, the larger the area of the VC heating board, the more conducive it is to heat dissipation, but the system engineering of mobile phone heat dissipation can not only look at the area of the VC heat exhaust plate, not to mention that the cost of VC materials is not low today, and it is necessary to comprehensively look at the manufacturer's supply chain integration, software and hardware tuning and cost control.