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Today to talk to you about: Huawei HiSilicon finally lived up to expectations, achieved three major breakthroughs in chips, and finally broke the defense!
Even in the face of difficult to solve the dilemma, Huawei has never given up HiSilicon Semiconductor, the birth of Kirin chip has created the glory of Huawei's mobile phone business, and its competitiveness is no less than Qualcomm's Snapdragon chip, which has also become an important part of Huawei's high-tech business.
At present, Huawei HiSilicon is not only doing mobile phone processors, but also developed PCs, base stations and other Internet of Things device processors, but also participated in the research and development of ISP chips and chip architectures, and has also made a major breakthrough in software business, the current total number of users of Hongmeng system is close to 200 million, and has been preparing to go to the European market, and its Euler system has also been donated, seeking social help to quickly build a complete ecological industry chain.
The way to deal with the dilemma
After TSMC was unable to OEM Huawei's self-developed chips, Huawei also personally admitted that it was in a lot of trouble, in the context of the temporary suspension of Kirin chips, Huawei did not give up continuing to invest in HiSilicon, but quickly responded to the team to enter the research and development of screen driver chips, and also announced that it had begun to lay out the semiconductor industry chain in an all-round way.
In the next year, Huawei through its Hubble investment, invested in a lot of domestic semiconductor companies, including similar EDA software, light source technology, chip process technology and other technologies, but also continue to increase investment in HiSilicon Semiconductor, pooling resources to help it find chip doctors around the world, a large number of recruits fresh graduates, inject fresh "blood" into HiSilicon, and repeatedly stated: "There will be no layoffs, as long as Huawei is still in a day, The investment in HiSilicon will not be broken! ”
Huawei's investment in research and development funds has always been "generous", with an annual investment of more than 100 billion yuan, and there is no second one in the country, and at such a critical moment, Ren Zhengfei announced that he would increase the size again, and then he would take 20% of the revenue as research and development funds, helping his various departments to overcome the core technology in the chip field.
HiSilicon achieved three major breakthroughs in chips
Huawei HiSilicon has not lived up to our expectations, there has been a new turnaround, although Huawei has declined in total revenue, but the profit margin has created a new high, at present, in addition to the mobile phone business and 5G communication business, the automotive business, 5GToB business and Hongmeng, Euler operating system, etc., have also become Huawei's new dependence.
Obviously, the goal of "surviving" as mentioned by the previous Zhengfei has been achieved, and the relevant restrictions have not dragged down the pace of Huawei's progress, but broadened the development direction of Huawei, Huawei has also had signs of breaking defense, and Huawei has also ushered in three major breakthroughs in the chip field.
One is that the new chip has been successfully developed, according to the latest news, the current scope of Huawei's self-developed chips has gradually expanded, in addition to the previous breakthrough of the screen driver, automotive chips, in the RADIO frequency chips and PC chips have also made a major breakthrough, and before the United States companies let go of the shipment of Huawei's automotive products, it can be seen that Huawei already has the self-development capabilities of automotive chips, which is almost in OEM manufacturing.
Huawei previously released a variety of flagship machines, even if equipped with 5G chips, or can not achieve 5G functions, the main reason is the lack of RF chips, and Huawei has achieved a major breakthrough in the technology, from the realization of commercial time will not be long, Huawei's PC chip Pangu M900, is expected to be officially introduced to the market in 2022, using 14nm process loading, mainly facing enterprise users.
The second is that Huawei has realized the packaging of 5nm chips, some time ago Huawei officially released the Kirin 9006C chip, all its parameters are basically the same as the previous Kirin 9000 chip, which means that this is the same batch of products, also from TSMC, but waited for a full year to be officially released, which must be a certain reason.
In the past, there has been news that Huawei has accepted a large number of semi-finished chips from TSMC, and this semi-finished product is likely to refer to the chip that has not yet been packaged and tested, but because Huawei does not have the packaging and testing process of the 5nm chip before, and with the official commercialization of this chip, it can be well confirmed that Huawei already has the ability to package and test 5nm chips, and this technology may come from itself, or from cooperative manufacturers.
The third is yu chengdong said that the return of huawei kings in 2023, which is an extremely obscure sentence, but we can still interpret a lot of information, Huawei's current business is gradually on the right track, in addition to the mobile phone business outside the industry, the requirements for chip performance are not high, and Yu Chengdong is referring to, it is likely that Huawei will solve the chip problem in 2023, and it may even be self-developed and self-produced chips.
At present, millet, OV and other mobile phone manufacturers, have begun to develop their own chips, especially in the ISP chip, has made a major breakthrough, obviously if huawei mobile phones can not restore sufficient supply, then the follow-up advantages will be smaller and smaller, plus MediaTek continues to grow, in the face of qualcomm and MediaTek double pressure, HiSilicon will also face greater challenges, what do you think about this?